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Keyword [TSVs]
Result: 1 - 20 | Page: 1 of 2
1.
Parasitic Parameters And Equivalent Circuit Reasearch Of Through-Silicon Vias (TSVs)
2.
3D ICs Placement Alogrithm Based On Nonlinear Programming
3.
Research On TSVs Fault-Tolerance In3D ICs
4.
The Study On Copper Electro-deposition In Through Silicon Vias
5.
Research On TSVs Test In3D-SICs
6.
Research Of The Fault-Tolerant Methods On TSVs And Buffers Of Three-Dimensional Network-on-Chip
7.
TSVs-aware Floorplanning For3D Integrated Circuit
8.
Scan Tree Design To Optimaze The Number Of TSVs And Leaf Nodes For 3D-ICs
9.
Test Wrapper Optimization Technique Of 3D Embedded Cores
10.
Research On Loss And Coupling Characteristics Of Optical TSVs
11.
Research On TSVs Fault-tolerance And Memory Stack In 3D ICs
12.
Research On Key Techniques Of Through-Silicon-Vias(TSVs) With Low Capacitance And High Interfacial Reliability
13.
Research On The Microwave Coupling Characteristics Of TSVs And 3D Integrated Microwave Passive Filters
14.
Research On 3D Memory Built-In Self-Repair Technology And TSVs Fault-Tolerance
15.
Test Strategies For Pre-bond Interposer And Post-bond TSVs In 2.5D And 3D ICs
16.
Modeling,Design And Optimization Of Differential Transmission Structure In 3-D ICs
17.
Fabrication and reliability testing of copper-filled through-silicon vias for three-dimensional chip stacking applications
18.
3-D ICs as a Platform for Heterogeneous Systems Integratio
19.
Enabling Technologies for 3D ICs: TSV Modeling and Analysi
20.
Characterization of copper diffusion in advanced packaging
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