Research On Optical Interconnection Network For Massive Parallel Processing System

No evidence has indicated the end of the greedy demand of higher performance of theinformation tranmission, processing and storage systems in the information era of today .The rapid development of microelectronics technology has greatly boosted the functionalityand enhanced the performance of a single integrated circuit chip. The electrical intercon-nect, which had ever dominated the short distance interconnection area, can not meet theincreasing interconnection bandwidth and density requirement of on-chip and off-chip in-terconnection any more due to its inherent physical property, and make itself a bottleneckto the performance of emerging information systems, such as high speed parallel processingsystems and the core switching systems. Facing the emergence of the interconnection crisis,engineers have to consider their high performance information systems from the point ofinterconnect design.For a point-to-point interconnected massively parallel processing (MPP) systems, thekey points of the physical layer of the interconnect network are the realization of the in-terconnection, the design of the cross-connect node and the interconnection relationship be-tween the cross-connect nodes. Focusing on the physical layer of the optical interconnectionnetwork of MPP systems, the author disscussed the topology of interconnection network forMPP systems, multistage interconnection network, optical cross-connect and chip networkon electro-optical printed circuit board in this thesis. As an example, a modified hybrid hi-eriarchical fully-connected optical interconnection network that can connect 215 nodes wasalso presented. The optical interconnection of chip-to-chip, board-to-board and rack-to-rackof the example was discussed in detail.A hieriarchical approach was proposed to obtain network topology with excellentstatic properties for MPP systems. Based on the fully-connect network and the hypercubenetwork, four regular topologies with uniform node degree–hieriarchical fully-connected(HFC) network, hieriarchical hypercube network, fully-connected hypercube network andhypercubic fully-connected network, were constrcuted to show the advantage of the pro-posed approach. Furthermore, a hybrid hieriarchical fully-connected (HHFC) network wasproposed by replacing the innermost fully-connected network of the multi-layer HFC net-work with indirect network to decrease the cost and improve the scalability. The proposedHHFC network exhibits promising property for MPP systems, where the node degree andnetwork diameter is independent of the scale of the system.The basic principle of constructing large scale cross-connect with combinatorial net- work and small scale cross-conect was proposed. Nonblocking combinatorial network ofC(2N,N,N) and C(2k,2k-1,2k-1) is presented and analyzed. Since blocking can be toler-ated to some extent for cost efficiency of optical switches, a blocking combinatorial networkof C(2k, 2k-1, 2k-1) with simple control and low cost was proposed. Analysis under the as-sumption that every inlet could connect to the two optical cross-connects of P(2k-1, 2k-1)with equal probability indicates that the average blocking probability of the proposed block-ing combinatorial network is less than 7.06 percent.A novel 2×2 wavelength selective cross-connect (WSXC) based on Bragg grating andMach-Zehnder interferometer was proposed. The proposed 2×2 WSXC was composed ofa Bragg-grating-based Mach-Zehnder interferometer, a pair of optical waveguide, a pair of1×2 optical switches and a pair of Y-model combiners. Since all the components can befabricated with optical waveguide, the proposed WSXC was prone to be integrated. Basedon the proposed 2×2 WSXC, multi-port multi-wavelength WSXC can be easily abtainedwith multistage interconnection networks.Imitating the computer network, a networking approach was proposed for future opto-electronic integrated ciucuit chip and multi-chip module interconnection on electro-opticalprinted circuit board (EOPCB), where copper was used to transfer electrical energy andwaveguide was used to transmit data. Finally, a modified HHFC optical interconnectionnetwork that can connect 215 nodes was presented as an example, of which opticalinterconnection, including chip-to-chip based on EOPCB, board-to-board based on arrayedwaveguide grating, and rack-to-rack based on fiber, was discussed detailedly.