The Study On Numerical Simulation Of Microwave And Millimeter-Wave 3-Dimensional Integrated Circuits

A numerical modeling method using in microwave three-dimensional structures is more difficult than one in two-dimensional structures. Microwave engineers' main task-object for overcoming the difficulty is how to obtain a high calculating efficient method. For the object, two methods modeling three-dimensional structures, complex image method and wavelet analysis method, are presented in the dissertation. These achievements are:1. Two methods modeling spectral domain Green's function in complex exponent functions, Prony's method and GPoF method, are also studied. The conclusions show that both techniques have worked properly for tested cases, and when spectral domain variable becomes very small, GPoF' method work slightly better than Prony's method does.2. A special structure with one very thin dielectric buffer layer is also analyzed by the two methods. Due to the fast variation of the spectral Green's function around the origin, both methods fail for small values of the spectral variable (the spectral function has a large relative error). The problem is solved by applying Prony's method (or GPoF's method) in two step scheme.3. The complex method is introduced for the analysis of the 3-D microwave structures as 3-D micro-strip thick patch structures, multi-conductor coplanar wave-guide transmission lines. Complex image theory is used to present Green's function, every thick conductor of the structures is modeled by some zero-thickness plates. Chebyshev polynomials are used as basis function to solve the integral equation by Galerkin's method. A comparison is also presented between the methodand other methods to judge their efficiency. The conclusions show that using the method in the structures is accurate enough and rapid convergence in short CPU time, the features of the method makes technique useful as CAD tool for these structures.4. The complex method is first introduced for the analysis of microwave 3-D metallization structures (air-bridge). A comparison is also presented between the method and some conventoinal methods to judge their efficiency. The conclusions show that using the method in the structures is also accurate enough and rapid convergence in short CPU time.5. It is first that this paper uses the wavelet expansion method to analysis three-dimension (3-D) planar problem. The structure is combinations of planar sheets of current oriented along normal and transverse direction in a stratified medium. The surface integral equation is analyzed using the mixed potential integral equation (MPIE), and solved through a Galerkin's method with unknown current expanded in term of two-dimension orthogonal wavelets (Daubechies' wavelet). Finally, two examples have been studied to demonstrate the validity and effective of the method. The technique leads to a sparse matrix, but the computation time is not always short.6. Another 2-D discontinuous micro-strip structure is also presented by using the wavelet expansion method. The surface integral equation developed from a dyadic Green's function is solved by Galerkin's method with unknown current expanded in term of one-dimension semi-orthogonal spline wavelets.