Micro Assembly Of The Key Technology

Micro-assembly process technology is a must-have electronics industry's technology。The subject of the actual needs of departure from the company's,Millimeter-wave products needed for the production of key technology of micro-assembly technology development。Micro-assembly technology is mainly the key bonding/sintering technology and micro-welding technology,It is the Micro-assembly technology to the important and basic technology。In this paper, a large number of related technologies in the access to information and integration of relevant work experience in the first study and explore from a technical point of view of the bonding /sintering technology and the principle of micro-welding technology, the key factors, failure modes, negative phenomena and their solutions methods, technical requirements and testing methods。Bonding/sintering process technology refers to the removal of the circuit substrate after the processing line, ceramic substrate, then through the conductive adhesive or by solder alloy sintered metal in the device cavity, thereby achieving the physical support of the substrate and heat dissipation。Substrate bonding /sintering process focused on the ultrasonic cleaning process and sintered solder /conductive adhesive curing process。Micro-welding technology, including chip bonding /eutectic technology, gold wedge/ball bonding technology。Chip bonding /eutectic technology refers to the semiconductor chip and carrier (package shell or substrate) to form a solid, conductive or insulating connections。In addition to the device solder layer provides mechanical connection and electrical connection, it must be for the device to provide a good cooling channel。Gold wedge /ball bonding technology is the use of metal wire (gold wire, etc), the use of hot-pressing or ultrasonic energy to complete the solid-state microelectronic devices within the interconnection circuit wiring connections, that is, circuit or lead frame chip and between the connections。Gold wire bonding in accordance with bonding and solder joints were divided into ball bonding and wedge bonding。In this paper, experiments with multiple functional results and experience to design the process, specific rules and process steps, device parameter settings were developed after completion of the development process through experiments carried out on the development of validated results show rational process, process method is reliable and effective process parameters。The subjects completed a comprehensive key technology of micro-assembly technology development requirements, the project team developed the"Rules of millimeter-wave micro-assembly process,""hybrid integration of key technology development","millimeter wave T / R module production process card"has been filed by the company identified and, I am drawing up a"millimeter wave sound production technology capacity-building grant program"has been through expert assessment, and in"Silicon Valley"National Science and Technology Academic Journals published"On the production of hybrid microwave integrated circuits"technology paper 1. The real issue is not only to fill in gaps in micro-assembly technology to solve the company's millimeter wave products T/R components of production problems。At the same time, in the development process, he accumulated a large number of experimental data and technology experience for the company overall development of micro-assembly technology development, laying a certain foundation。...