| With the development of integrated circuit and miniaturization,the packaging technology has been developed to meet the requirements of new technology and new process.The semiconductor chip in the integrated circuit is mainly connected with the external pin or pad by the wire bonding technology.This paper focuses on the technology of gold ball welding.In order to solve the problem of low bonding rate by using the original proc ess parameters in the 50?m gold ball welding,the process parameters of 50?m gold ball bonding were studied.First,the influence of the process parameters on the bond tension was analyzed by using the gold-gold bonding method,then analyzed the problem that chips damaged by using the current production process of goldaluminum bonding,considering the balance relations between the two,get the best parameters of the chip bonding.The main research contents are as follows:Firstly,through the study of the process and the failure mechanism of gold ball welding,determined the main factors of the research are the bonding pressure,ultrasonic power and ultrasonic time,and the influence of the three factors on the bonding quality is analyzed.Secondly,based on the existing bonding equipment and materials,use the AuAu bonding way,through the fixed other two factors and only change the single factor parameters,respectively to study the ultrasonic power,bonding pressure,and ultrasonic time of single factor experiment,the influence of various factors on the bonding tension were summarized.Then,according to the range of parameters determined by single factor influence experiment,the influence experiment of multi-factor process parameters was designed by orthogonal experiment method,the influence of various process parameters on bonding tension was determined,and the optimal combination of process parameters was determined.Finally,using the optimal combination of process parameters to bond chips,bonding tension fails to reach the best effect.By comparing with the original process parameters,the orthogonal experiments were carried out between the two groups of process parameters,the main factors that cause the chip damage were found,and determined the influence relationship between the various factors leading to the chip failure.Finally,the optimal process parameters of each type of chip were verified and determined.Using optimized parameters combination for the related products production,make the bonding rate and product pass rate improved and solved the problem of low production rate. |
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