Research On Micro-assembly Process Technology Of Millimeter Wave T/R Components

Microwave multi chip module(MMCM)technology in hybrid microwave integrated circuit(HNIC)developed on the basis of a new generation of microwave packaging and interconnect technology,it is more than one MMIC/ASIC chip and other components of high density assembly in 3D microwave multilayer circuit interconnection substrate,forming high density,high reliability and multifunction circuit assembly.This is conducive to the realization of high performance components,and high density electronic assembly,miniaturization and lightweight.The millimeter wave T/R component technology of micro assembly.The research and analysis are carried out for the welding defects through integration: selection and design of tooling materials,welding fixture integration was prepared;temperature curves of vacuum eutectic furnace,and make adjustment,finally get the proper temperature curve of the test workpiece,improve the penetration rate.After the welding workpiece X light detection.The chip welding and bonding technology were studied: the factors that affect the penetration rate of the chip eutectic welding were eliminated and verified;the bonding process test and the characteristic outgassing rate of the adhesive material were studiedThe wire bonding and bag control: manual bonding equipment on the main bonding parameter window of exploring and semi automatic control equipment of high arch span.And through the auxiliary simulation software,proved that the arch height and distance of the substrate connector components applicable to the wire height.Study on laser welding seam welding technology: establish the finite element model of laser welding aluminum silicon material,obtained by numerical calculation of the temperature field of silicon Aluminum Alloy laser welding and stress field.The welding heat high silicon Aluminum Alloy package box of the maximum stress at the edge of the shell is located in the vicinity of the weld,yield strength the maximum thermal stress is smaller than the shell material.Through the study of laser welding of the welding process parameters,the most suitable welding parameters were determined.