Research On Micro-Assembly Technology

Microelectronic assembly technology is a new generation of electronic assembly technologybased on semiconductor integrated circuit technology,hybrid integrated circuit technology and surface assembly technology.It uses high-density multi-layers,and micro-welding technology to install multiple semiconductor bare chips on the circuit substracte to achieve physical and electrical connections.Micro-assembly technology is one of the key technologies to achieve miniaturization,high performance and high reliability of electronic equipment,which is widely used in military and civil fields.In this paper,the micro-assembly processes used in the assembly process of microwave muti-chip module semiconductor components are studied.Firstly,research on eutectic welding technology: By developing the eutectic sintering function of vacuum sintering furncec and automatic patch machine,the reliable welding of low void rate between chip and carrier was realized,and the paramerers of eutectic welding were determined.Secondly,research on gas cleaning technology: The principle of gas cleaning equipment,selection of cleaning solvent and determination of cleaning effect are introduced.Thirdly,research on chip bonding technology: Introduced the bonding principle,the principle of bonding selection and kneading,the factors affecting the bongding quality,and determined the key process parameters.Fourthly,research on plasma cleaning technology: The principle of plasma equipment,selection of cleaning gas and judgment of cleaning quality are introduced.Finally,research on wire bonding technology: The principle and mode of bonding,the selection range of wire materials,the basis of bonding quality judgement and so on are introduced,and bonding parameters are determined.