Research On Highly Integrated Waveguide Passive Devices In The Short Millimeter Wave Ban

Millimeter-wave band is generally defined as 30 GHz～300 GHz,which has important application prospects in many fields such as radio astronomy,radar detection,wireless communication and so on.Among them,the research of some low-loss passive waveguide devices in high frequency band and high precision process conditions is an important frontier research direction in this field.The performance of the passive devices is directly related to the overall performance of the detection/communication system,including W band,220 GHz and other typical windows.Based on the application background of highly integrated millimeter-wave receiver in the field of radio astronomy,this thesis studies several RF passive components in the front end,including high integration filter,high isolation power division network and low loss mode converter.The content of the paper is summarized as follows:1.Multilayer integration and packaging of W-band waveguide filter based on CNC technology.Aiming at the application requirements of W-band highly integrated solid-state receiver system,the multilayer stack packaging technology of W-band waveguide filter in CNC technology is studied.The main contents include:the quasi-elliptic response is achieved by the folding transformation of the fourth-order linear waveguide filter and the cross-coupling between layers;based on CNC technology and right angle transition,multilayer fabrication and packaging were realized.Combined with the measured results,the error analysis and performance comparison of different layer packaging structures are carried out by electromagnetic field software,and the feasibility of multilayer packaging integration under CNC technology is verified.2.W-band TE₁₀-TE₂₀mode converter based on CNC technology.Aiming at the application requirements of high integrated waveguide circuit packaging power active devices,this paper designs a full W-band TE₁₀-TE₂₀mode converter based on CNC technology.The main contents include:the integrated design of E-plane power division structure and integrated twisted waveguide structure to realize the mode conversion from E-plane TE₁₀to H-plane TE₂₀;Combined with H-plane out-of-phase power division structure,the three-port module to be tested was completed based on CNC technology.The measured loss and other performance are highly consistent with the simulation results,which verifies the high efficiency,low loss and feasibility of the device.3.High isolation power division network based on CNC technology at 220 GHz band.Aiming at the application requirements of local oscillator power distribution in multi-pixel receiver system,this paper also proposes two designs of high isolation four-way power division networks at 220 GHz band,including 1×4 and 2×2 pixels,and verifies the 2×2module based on CNC technology.The main contents include:high isolation design of four-channel power division network based on 3 d B directional coupler;According to the requirements of the array element,the structure of the waveguide elbow was cascaded to realize the compact scheme of 1×4 and 2×2 pixel power division network.The 2×2 pixel module is realized by CNC technology.The measured results show that the power ratio is-7d B±1 d B,the 3 d B bandwidth is 20%,and the channel isolation is better than 15 d B.4.High order mode dual passband waveguide filter based on DRIE technology at220 GHz band.In the end of this paper,an ultra-integrated 220 GHz band dual-passband filter is studied based on silicon based deep technology.The main contents include:the third-order TM₁₂₀and TM₂₁₀degenerate mode resonators are used,and the bypass coupling of the non-resonant mode TM₁₁₀is combined to realize the dual-passband filter response under multi-zero control.The filter was designed as a 9-layer distribution structure,fabricated and assembled based on DRIE technology,and a compact package structure with a thickness of only 2.34 mm was obtained.The measured results are in high agreement with the simulated data,which verifies the feasibility of the overmode cavity filter in DRIE and other micro-process multilayer packaging technologies.