Research On Routing Algorithms Of Three-dimensional On-chip Networks With Different Structure

With the development of multi-core technology,Network–on–Chip(NoC)has replaced the traditional point-to-point and bus communication methods.In order to design the NoC with much smaller connection length,thus reducing power consumption,improving packet routing flexibility and increasing the mapping density of the IP cores in the network,a three-dimensional network on chip(3D NoC)based on Through Silicon Via(TSV)was adopted.This thesis the structures of the fully connected 3D NoC,partially connected 3D NoC,hybrid wireless fully connected 3D NoC,hybrid wireless partially connected 3D NoC have been thoroughly studied and the routing algorithm suitable for these structures have also been proposed.For the routing problem of fully connected 3D NoC and partially connected 3D NoC,the traditional A * algorithm has been improved so that it can be well applied to the 3D NoC structure.The overheated nodes generated by the stacking structure of 3D NoC are regarded as nodes with fault.The improved A * algorithm can well solve the system failure caused by overheated nodes.Then,in order to improve the packet transmission delay,a 3D NoC with hybrid wireless structure is proposed,and a maximum three hop routing algorithm suitable for this hybrid wireless full connection3 D NoC and hybrid wireless partial connection 3D NoC is also designed.The final experimental simulations show that the improved A * thermal aware routing algorithm in the fully connected 3D NoC can improve the throughput by 34.84%,42.9%,45.5%and 32.7% respectively compared with the previous Downward,TLAR-DLDR,TLARDLAR and TLAR-DLADR.The power consumption is reduced by 36.77%,29.59%,21.28% and 13.97% respectively;Compared with the previous Downward,TLARDLDR,TLAR-DLAR and TLAR-DLADR,the improved A * thermal aware routing algorithm is used in partially connected 3D NoC,and the throughput is increased by16.8%,23.9%,26.0% and 22.6% respectively.The power consumption is reduced by24.94%,19.07%,10.31% and 0.91% respectively.Finally,through the temperature heat map,it can be concluded that the improved A * algorithm proposed in this paper makes the temperature distribution of the whole system more evenly.Compared with the improved A * algorithm proposed in this paper,the average delay is reduced by37.69% and the maximum delay is reduced by 35.47%.