Analysis Of The Effect Of Wettability Of System Components On The Results Of Transfer Printing Micro-dispensing

Fluid dispensing technology is a key technology in micro-packaging engineering and is widely used in micro-electro-mechanical systems,micro-nano manufacturing,life-science and other fields.With the development of microelectronics technology,electronic products are becoming increasingly mini-aturised and diversified,and the requirements for packaging processes are becoming higher and higher,which also places demands on the dispensing technology such as microvolume,high efficiency and the ability to quickly adapt to the working environment.So precision dispensing technology is one of the important research topics in modern manufacturing.Aim at addressing the problems of existing dispensing technology,such as the inability to achieve micro-dispensing and the inability to guarantee the consistency of the glue spot with continuous dispensing,this article proposes a transfer dispensing method,which can achieve p L-level glue dispensing by using the motion of a slender pipette needle to transfer tiny drops of glue to the dispensing surface.The effect of the wettability of the main components on the dispensing results in this dispensing method is investigated in order to control the dispensing volume more precisely to achieve the requirement of on-demand dispensing.Firstly,the principle of the implementation of the transfer dispensing method is introduced,and the coupling of small surface forces at each stage of the dispensing process is analysed;the components and factors affecting the dispensing performance are discussed in modules,and the relationship between the volume of the glue spot and the wettability of the transfer needle,the wettability of the dispensing surface,and the surface tension of the glue is described using a mathematical model.A hydrodynamic model of transfer dispensing is established on a theoretical basis.The entire dispensing process is simulated and the effect of changes in the wettability of the main component surfaces on the dispensing volume is analysed.Finally,the transfer type dispensing experimental platform is built,and the performance of the experimental device is tested by continuous dispensing.Single-factor experiments are conducted to verify the laws obtained from theoretical and simulation analyses,and orthogonal experimental methods are used to determine the primary and secondary order of the influence of the pipette needle,the wettability of the dispensing surface and the surface tension of the adhesive on the dispensing results;the dispensing experiments are conducted on the surface of microelectronic materials using the dispensing device to verify that the action laws obtained in this article can help to precisely control the amount of glue dispensed.The final experimental results show that as the wettability of the dispensing surface decreases and the surface tension of the glue increases,the dispensing volume tends to decrease,while as the wetting of the transfer needle decreases the dispensing volume tends to increase,with the wettability of the dispensing surface being the main influencing factor.Through conducting dispensing experiments on a variety of microelectronic materials,the practicality of the laws obtained from the experiments was verified.By matching different diameter pipetting needles according to the wettability of the materials and the laws obtained,the effect of obtaining different material surface glue distribution deviation of less than 3p L,can meet the requirements of the packaging engineering on-demand distribution.