| With the continuous improvement of the intelligence of ships,high-power integrated electronic components are widely used in various ship systems,and efficient heat dissipation is the prerequisite for the stable operation of the system.Gallium-based low melting temperature alloys has excellent heat transfer performance.When used as a thermal interface material,it can effectively reduce thermal contact resistance,improve system heat dissipation efficiency,and has good application prospects.However,low melting temperature alloys also has problems such as non-wetting with solid surface,strong fluidity and easy overflow.Aiming at the shortcomings of gallium-based low melting temperature alloys in actual use,this article first uses hydrochloric acid solution to improve the wettability of low melting temperature alloys on the copper substrate;on this basis,copper powder and copper mesh are combined with low melting temperature alloys to prepare thermal interface materials,and reduce the fluidity of the low melting temperature alloys;finally combine the solid-liquid thermal contact resistance theoretical model with the composite thermal conductivity theoretical model to establish the composite thermal interface material thermal interface resistance theoretical model.Through the above research work,the following three main conclusions can be drawn:(1)The hydrochloric acid solution can effectively improve the wettability between the low melting temperature alloys and the copper surface.After the wettability of the hydrochloric acid solution with a concentration of 10 mol/L,the contact angle between low melting temperature alloys and copper substrate is reduced from 126° to 21°,and the thermal contact resistance of the sample is reduced by about 70%;(2)The thermal contact resistance of the thermal interface material prepared by the composite of copper powder and copper mesh with low melting temperature alloys is greater than that of pure low melting temperature alloys,the composite thermal interface material effectively reduce the fluidity of low melting temperature alloys and prevent overflow;(3)The established theoretical model of interface thermal resistance of composite thermal interface materials can predict the change trend of contact thermal resistance with applied pressure and the number of copper meshes in composite materials. |
