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Design Of Temperature Sensor Module For Power Battery Management Chip Of New Energy Vehicl

Posted on:2024-05-03Degree:MasterType:Thesis
Country:ChinaCandidate:J F ShenFull Text:PDF
GTID:2532306917475054Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
Based on the growing demand for new energy vehicle power battery management chips,a detection circuit is designed to detect the core temperature of the vehicle power battery management chip and the temperature of the battery pack.The on-chip temperature collection ΣΔ Design of three sub modules for ADC and digital transmission interface in 0.35μm 60 V BCD process.Firstly,a temperature acquisition front-end circuit was designed.The on-chip temperature sampling circuit operates within the temperature range of-50℃ to 150℃,with a measurement error of less than ±5℃.We have designed an anti EMI operational amplifier specifically designed for automotive environments with strong electromagnetic interference for pre amplification and anti-aliasing filtering,to improve the system’s signal-to-noise ratio,reduce the relative impact of external interference,and achieve impedance conversion and matching.Secondly,a second-order incremental equation was designed ΣΔ ADC has completed the structural selection and model validation of the modulator,analyzed and modeled the non-ideal characteristics of the circuit,providing reliable guidance for the design of specific circuits.Direct detection of wide common mode and unipolar signals is achieved when the core circuit operates in the low-voltage domain.The simulation results show that the effective digits are 14,the absolute error applied to multi-channel battery pack temperature detection is less than 0.8m V,and the signal-to-noise ratio is 99.8d B.Finally,the digital interface circuit for the communication between the temperature sensor module and the So C control unit,as well as the testability design of the digital circuit,are respectively 14-bit SPI bus,error correcting two bit error correction code based on Hamming code,standard test access port and Boundary scan structure conforming to IEEE 1149.1.The analog circuits of the above modules have been designed,layout,and post simulation completed,while the digital circuits have been designed,synthesized,and FPGA verified.
Keywords/Search Tags:0.35μm BCD process, Battery management chip, Temperature sensor, ΣΔADC, Anti EMI operational amplifier
PDF Full Text Request
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