Preparation,Analysis And Characterization Of Diamond Dicing Blade For Silicon Carbide

The intensive introduction of energy-saving technologies all over the world imposes increasingly stringent requirements on power and electronics devices,which it is not always possible to fulfill using a traditional silicon-based electronic component.Therefore,there is an increasing interest in wider-band materials,including silicon carbide.Silicon carbide is a material that is at an early stage of implementation,but already has a wide field of practical application.This semiconductor material belongs to class A3B5 and has a wide band gap capable of raising the performance of power devices to the highest level.It is also characterized by high hardness（9.2-9.5 on the Mosca scale）and chemical resistance,but its main disadvantage is low crack resistance,which complicates the processing of substrates made of this material.Such materials have high hardness,but are quite brittle,which causes the complexity of their processing and increases the requirements for the accuracy of the equipment.To ensure a high-quality result of processing such materials,this paper proposes a systematic analysis of the factors affecting the production and preparation of the cutting blade.A mathematical model is being created to analyze the loaded state.The actual cutting test of the blades and their comparative analysis are performed when cutting materials of different hardness.The main content of the study:（1）The study summarize the main types of diamond cutting tools,each of which is suitable for certain tasks.Then two types of cutting blade matrices are proposed and the technology of their preparation is considered.The production is based on the method of metallurgical hot pressing and sintering of powders.The analysis of the formulation composition and the influence of the elements used on the physico-chemical properties of the resulting blades is carried out.The factors affecting the quality of the resulting blades,also called"eight phases",are considered.During the hot pressing and sintering process,the pressure gradually increases at three stages of transition,reaching 30 MPa,and the sintering temperature of each composition is 762℃,700℃,675℃,650℃.（2）The theoretical calculation of the maximum values of stresses and displacements arising during the operation of the cutting blade at different cutting parameters is carried out to identify the most optimal working conditions of the blade.Also,using the finite element method,the lateral force arising during the operation of the blade is calculated.The data obtained show the lateral force can affect the cutting quality.A slight displacement due to the influence of lateral force on the working surface of the blade equal to 5.27×10^-4 mm.（3）A type of ultra thin resin dicing blade was prepared by the method of photocuring preparation.The influence factors of preparation are analyzed in this study.The results shows the mould,binder and parchment paper have importance influence on the preparation of resin dicing blades.The used of parchment paper is benefit to separate the dicing blade from the glass substrate,but it can reduce the flatness of the dicing blade.（4）In order to characterize the performance of dicing blade,an experimental device is set up.The spindle current is used to analyze the performance of dicing blade.The results shows that the spindle current increases with cutting distance.The wear of five dicing blade decreases with the rotational speed.The cutting with high rotational speed is benefit to the decrease the wear of dicing blade.The spindle current increase remarkable with the cutting depth.When cutting hard and brittle materials with low strength,the cutting effect of a matrix with higher strength was worse than that of a matrix with lower strength.For a matrix with a lower hardness,a cutting test of a material with a lower hardness is performed.The value of the current consumed is the lowest,and the roughness of the resulting surface is 12 nm.Tests were carried out for cutting with a blade with a reinforced matrix of two materials at different cutting parameters.The result showed that the low feed rate provides better results when cutting materials of high hardness.（5）The cutting performance of dicing blade before and after sharpening is investigated.The comparisons of tool life and chips demonstrates that the dicing blade obtains lower tool wear and cutting defects by a mode with a feed speed of 4 mm/s,a rotation speed of 23000 rpm and a cutting depth of 0.1 mm.