Development And Characterization Of Diamond Ultra-thin Dicing Blades

As the third-generation semiconductor material,silicon carbide occupies an important development position in the national 14th Five-Year Plan.Hard and brittle materials have the characteristics of high hardness,high brittleness,and difficult processing,and the dicing requirements are more stringent in high-precision equipment.To ensure better processing characteristics of hard and brittle materials.This paper systematically analyzes the influencing factors of dicing wafer preparation and designs two types of matrix,a variety of dicing blades with bonding strength,and the actual dicing test,tool performance characterization evaluation,and dicing mechanism analysis are carried out.The specific research contents are described from the following five aspects:(1)Two new types of substrate cutting blades and key technologies for preparation are proposed.Relying on the principle of powder hot-pressing sintering and single factor characteristics,the "eight major phases" influencing factors and two matrix models are proposed for the systematic analysis of the formula.The powder’s microscopic change trend and the driving force’s calculation were analyzed,and the matrix with different bonding strengths was prepared.During hot pressing sintering,the pressure gradually increased with the three stages of transition,low temperature alloying and heat preservation,and the temperature reached 30 k N.The sintering temperature of each formula was 762℃,700℃,675℃,and 650℃,respectively.(2)Comparative analysis of actual force measurement and calculation of dicing blade processing.Based on the mechanical properties of the dicing blade,a force measuring device was built and the force value was collected,and it was found that with the fluctuation of the bonding strength,the error conditions were different.At 23000 rpm,the force of the dicing blade is the smallest,the E dicing blade has a minimum value,and the dicing performance is better when combined with the slightly weaker C dicing blade.The force measurement test was carried out on the silicon wafer,and the results showed that when dicing low-strength hard and brittle materials,the effect of the reinforced matrix was worse than that of the weakened matrix.(3)Build a dicing test platform and conduct orthogonal tests.In the silicon wafer dicing test,the spindle current value shows the best performance when the feed rate is 4mm/s,the spindle speed is 23000 rpm and the amount of back-feeding knife is 0.1mm.Test results of materials with different hardness: C dicing blade has low spindle current value and 14 nm dicing edge roughness for dicing high hardness materials.The weakened matrix cuts low-hardness materials,the spindle current value is the lowest,and the dicing edge roughness is 12 nm.The reinforced matrix has been tested on two materials under various parameters,and it is shown that for high hardness materials,low feed speed produces better dicing results.Data fitting analysis was performed on the dicing blades and test parameters.(4)Evaluation method and tool life analysis of hard and brittle materials.The formula of edge chipping coefficient is proposed,and edge chipping measurement and comparative analysis are carried out on the dicing effect before and after sharpening.Morphology characterization of edge chipping and chipping coefficient analysis of reinforced matrix for high hardness materials.The comparative analysis of tool life and edge chipping trend shows that the E dicing blade has less tool loss and the lowest edge chipping coefficient when dicing silicon wafers at a feed rate of 4mm/s.(5)Evaluation of the comprehensive performance of two matrix dicing blades and analysis of material removal mechanism.Quantification of abrasive grain exposure,offset coefficient and matrix hardness,SEM,and EDS analysis were performed.It is known that the higher the degree of matrix bonding,the lower the exposure of abrasive particles and the lower the coefficient of the partial knife.The reinforced matrix has a better dicing effect on high-hardness materials than others and has the opposite performance on low-hardness materials.The three-dimensional topography map was observed with a super depth of field.Analyze the failure mechanism of small-spacing dicing,and obtain the relationship between the hardness value of the matrix and the dicing quality.The high bond strength dicing blade controls the integrity of the material partition better.