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Numerical Simulation Of Inductance Of Liquid Composites Molding

Posted on:2024-04-27Degree:MasterType:Thesis
Country:ChinaCandidate:H WangFull Text:PDF
GTID:2531307172970049Subject:Materials Science and Engineering
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The rapid development of electronic products,aerospace,new energy vehicles and other industrial fields puts forward higher requirements for the performance,quality and life of inductances.The previous integrated forming process is compression moulding forming.Due to the high forming pressure,it is easy to cause problems such as breakage of inductance insulation layer,coil offset,uneven distribution of inductance density,etc.so a new forming process is urgently needed to solve the above problems.The project commissioned enterprise put forward a new forming method of integrated inductance-liquid composites molding.The method has low pressure in forming inductance,which overcomes the existing problems in compression moulding forming and greatly improves the quality of inductance.However,as a new inductance molding method,its molding process and mold structure still need to be optimized.Therefore,this thesis combines numerical simulation with experiment based on orthogonal experiment,this thesis will study the influence of molding process,mold structure and process parameters on the quality of inductance molding.The research results have theoretical guiding significance for optimizing the process and mold structure.It is of great value to improve the quality of integrated molded inductances and reduce the cost.In this thesis,The density of composite materials(FeSiAl/ epoxy resin)was measured by Archimedean drainage method.Then the solidification temperature and melting temperature of the material were measured by DSC,the curing kinetics model was established,and the material parameters required for simulation were obtained.For the two processes currently used by enterprises,numerical simulation of the molding process is carried out.Process 1 is heating up to curing temperature-material placement-mold filling-heat preservation and solidification-mold opening.Process 2 is to put the material into-heating to melting temperature-filling molding-heating to curing temperature-insulation curing-mold opening.By comparing the simulation results of the two processes,it is concluded that the filling time,curing degree,number and size of pores and stress of process 1 are better than that of process 2,and process 1 is determined to be the better process.Taguchi orthogonal experiment was conducted based on process 1,and the order of influencing factors on filling time was as follows: filling speed > curing temperature;the order of influencing factors on porosity was as follows: curing time > filling speed >curing temperature;the order of influencing factors on curing degree was as follows:curing temperature > curing time > filling speed;the order of influencing factors on coil migration was as follows: curing temperature > curing time > filling speed.The optimum process parameters of the inductor were obtained: curing temperature 175℃,curing time160 s and filling speed 3mm/s.In order to further reduce coil offset,the mold optimization,simulation of inductance forming process based on optimized mold,the optimized mold forming inductance coil offset and stress reduction.Taguchi orthogonal experiment was carried out based on optimized mold,and the order of influencing factors on filling time was as follows: filling speed > curing temperature;the order of influencing factors on porosity was as follows: curing time > filling speed > curing temperature;the order of influencing factors on curing degree was as follows: curing temperature > curing time >filling speed;the order of influencing factors on coil migration was as follows: curing temperature > curing time > filling speed.The optimum process parameters were obtained: curing temperature 185℃,curing time 160 s and filling speed 5mm/s.The inductance liquid composites molding were carried out based on the optimal process parameters of the inductance of the original mold and the optimized mold.The inductance properties of the optimized mold were improved and the coil offset was reduced by comparing the inductance properties of the original mold and the optimized mold.By comparing the quality of liquid composites molding inductance with that of compression moulding forming inductance,the quality of liquid composites molding inductance is better than that of compression moulding forming inductance.
Keywords/Search Tags:FeSiAl powder, one molding inductance, liquid composites molding, numerical simulation, orthogonal experiment
PDF Full Text Request
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