Grinding Mechanism Of Tungsten Alloy And Experimental Research On Laser Assisted Grinding

Tungsten alloy is a dual-phase composite material composed of a tungsten phase and a binder phase.It has the characteristics of high density/strength,good plasticity,and good electrical and thermal conductivity.It is used in the fields of aerospace,nuclear industry,civil industry and national defense industry.Due to the characteristics of high density,high hardness,and obvious difference in dual-phase properties of tungsten alloys,tungsten alloys have certain challenges in achieving efficient and high-quality processing.At present,the research of tungsten alloy material removal processing mainly focuses on cutting,grinding and polishing.However,due to the large difference in the characteristics of the tungsten phase and the binder phase,problems such as severe tool wear,chip adhesion and poor surface integrity are prone to occur during the cutting process of tungsten alloys.Although grinding and polishing can reduce the processing damage of tungsten alloy,the removal rate of grinding and polishing tungsten alloy material is low,the processing effect is unstable,and the height difference of different phases appears in the polished tungsten alloy.Grinding is a high-quality and high-efficiency machining method suitable for difficult-to-machine materials,but there are few reports on the grinding process of tungsten alloys.In this paper,the grinding mechanism of tungsten alloys will be explored by carrying out single abrasive scratching simulation,scratching experiments and grinding experiments.The possibility of laser ablation texture-assisted grinding in improving grinding quality and reducing grinding force and damage was also studied.Firstly,the abaqus software was used to model the single abrasive grain rotary scratching to analyze the removal characteristics of tungsten alloys at different scratching stages.Then the linear engraving of single abrasive grain was modeled to analyze the changes of stress,strain and scratching force under different process parameters,thus paving the way for the experimental analysis of scratchingSecondly,a single abrasive grain scratching experiment was carried out,and the removal morphology of tungsten alloy was analyzed from different scratching stages and different phases.The material removal mechanism of tungsten alloys was explored in combination with rotational scratching simulation and experiments.The accuracy of the simulation is verified by comparing the feature removal in the experimental scratching stage with that in the simulation scratching stage,the experimental scratching force and the simulated scratching force.On this basis,the tungsten alloy grinding experiment was carried out,and the grinding removal features were consistent with the scratching removal features.The scratching experiment and the grinding experiment jointly revealed the grinding mechanism of tungsten alloy.Finally,nanosecond laser was used to ablate four textures of different shapes on the surface of tungsten alloy,and then a diamond resin-based grinding wheel was used to carry out grinding processing experiments on the ablated tungsten alloy.The processing effects of ordinary grinding and laser ablation texture-assisted grinding are compared in terms of surface morphology,subsurface damage,surface roughness and grinding force.The results show that the surface morphology of tungsten alloy processed by laser ablation texture-assisted grinding is slightly better,the subsurface damage is reduced,the surface roughness is reduced,and the grinding force is reduced.Thus,the advantages of laser ablation texture-assisted grinding of tungsten alloys are revealed,and theoretical guidance is provided for the realization of high efficiency and low damage of tungsten alloys.