Research Of Three-Dimensional Inductor Based On Glass

The increasing demand of RF system integration requires the miniaturization of active and passive devices.Inductor as the basic component,the micro-RF inductor based on silicon substrate is constantly changing towards three-dimensional structure to meet the development demand of high integration.However,as a kind of semiconductor,the high conductivity of silicon leads to additional loss of RF inductor,including its own substrate loss and eddy current loss caused by alternating magnetic field in the substrate.Glass has the advantages of high resistance and low dielectric loss.The development of glass technology makes the micro-inductors based on glass substrate have better RF performance.Through Glass Vias(TGV)technology ensures the through hole machining of the ratio of height to depth to diameter,and realizes the high performance of the 3-D inductor.In this thesis,high fructose corn Syrup(HFSS)software is used to design and simulate the glass-based 3-D inductor,and the 3-D inductor production process is in-depth.Based on TGV technology,the high performance inductor production is realized through the combination of software simulation and physical production.The main research of this thesis is as follows:1.Predictively analyze the process errors on conduct existing in the process of inductor manufacturing,use HFSS software to simulate the errors,and explain the simulation results.Different glass substrate and magnetic core materials are simulated,and appropriate materials are selected to manufacture inductors.The importance of balancing the advantages and disadvantages of different materials and structures in designing high performance RF inductors is presented.2.The TGV process involved in the production of glass-based 3-D inductor was found out,and the parameters in the TGV preparation process were optimized,and the different processing processes of photosensitive glass and BF33 glass substrate were studied.Finally,high density through hole fabrication and through hole metallization process with depth to diameter ratio of 10:1 were realized on glass substrate,which provided the basis for high inductance density inductor.3.A glass 3-D inductor with high inductance density was fabricated on the basis of the high depth to diameter ratio through hole and high precision fine wire machining.In addition,when the glass 3-D inductor is manufactured,the glass substrate slot is filled with the magnetic core material,and the inductance density of the magnetic core is further improved.The performance of the glass 3-D inductor and the magnetic core inductor is tested by using vector network analyzer.Compared with silicon inductors,the inductance density of glass base inductors is improved by 10~2 orders of magnitude,and the quality factor of glass base inductors is better than most silicon base inductors.Before and after Ni-Zn ferrite filling,the inductance density of 3-D inductor is 56.83 nH/mm~2 and 102.89 nH/mm~2,respectively.After filling with magnetic core,the inductance increases up to 80%.