Study On Abrasive Coating And Processing Method Of Diamond Micro Ultra Micro Drilling And Grinding Tools

Due to the wide application of micro devices in the fields of aviation,medical biology and so on,the manufacturing of micro devices plays a very important role.It is found that micro grinding is a reliable precision machining method in micro machining,and it is inseparable from the preparation of micro tools.Therefore,this paper focuses on the preparation of tools in micro grinding,carries out simulation analysis and Experimental Research on the uniformity of abrasive coating of micro drilling and grinding tools,and mainly carries out simulation analysis on the important links in the preparation process,The purpose of this paper is to improve the problem of uneven coating caused by the tip effect in the electroplating process,put forward the solution and apply it to the research of micro machining.In order to improve the coating uniformity of micro grinding rod(0.5mm),this paper studies the effective measures to improve the coating uniformity.The influence of the layout of the anode and cathode,the position and size of the additional devices(insulation baffle and plating ring)on the uniformity of the coating were considered.Modeling and simulation calculation are carried out in COMSOL multiphysics software.Pb experimental design and response surface experimental design method of design-Expert 8.0 Software are used for numerical analysis to obtain the optimal parameters.Six important geometric parameters were introduced to establish the electroplating simulation model,and a series of electroplating parameters were set up.The secondary current distribution close to the actual electroplating environment was used as the physical field.Considering the hydrogen evolution reaction in the electroplating process,the coating nonuniformity coefficient COV was introduced to evaluate the advantages and disadvantages of the coating.The experiment design includes three steps:firstly,the climbing experiment is carried out,which refers to the range of geometric factors selected by single factor experiment,and then the main factors affecting COV are selecte d by Plackett Burman experiment design.Finally,the response surface method is used to find the optimal combination and response value(COV)of all factors in the whole region,and the optimal parameter combination takes the minimum COV as the goal,The optimization function of design-expert 8.0 software is used to solve the problem,and the accuracy of the parameters is verified by experiments.In this paper,the method of "Z" type micro hole machining is proposed,the machining principle and process are modeled,the material removal mode in the machining process is analyzed,and the average grinding force model is established.The micro grinding rod is used to process micro holes on the single crystal silicon wafer,and the influence law between grinding force and processing parameters is explored to verify the grinding force model proposed in this paper.At the same time,the ultra-fine grinding rod(30μm).At the same time,the grinding rod was used in the actual production to verify the practicability of the grinding rod.