Experimental Research For The Quality Of Slicing Sapphire Wafer

Sapphire(Al2O3)has good optical,physical and chemical properties.It is an important basic material for modern industry.It is widely used in instrumentation,military industry,electronics,LED and other fields.The processing process of sapphire substrate are mainly slicing,edge,annealing,grinding and polishing.The first process of slicing ingot into sapphire wafers are used for the multi-wire slicing machine and electroplated diamond wire.In this paper study for the surface of sapphire wafer processed by electroplated diamond wire combined with multi-wire slicing machine.The main research objects are sapphire wafers thickness,total thickness variation(TTV),warping(Warp),bowing(Bow),surface roughness(Ra)and the variation of surface morphology with slicing position and slicing parameters.The main research results of this paper are summarized as follows::1.Research using diamond wire to slice the same sapphire ingot,the surface quality are different at slicing positions.It is mainly for the particles on the diamond wire are worn at different positions,the distribution of diamond particles uneven.2.Slicing parameters have great influence on the surface morphology and quality of the sliced wafers.It is suitable for increasing the consumption of diamond wire(15-20m/pcs)deviation angle for slicing stage(0-8°)and so on can effectively to realize the precise of the surface morphology of sapphire wafers.3.Analysis for different wire position wafers,morphology can be improved after double lapping.It is found that double lapping can significantly repair different wire position wafers’morphology.Under different lapping pressure,the different repair for the sapphire sliced wafers.The lapping pressure of 3.0kPa was better than that of 6.0kPa.When the lapping pressure is low,the pressure effect on sapphire wafer is small by lapping’ plates,and the elastic deformation of the wafer is also small.Therefore,the repair effect of sapphire wafers morphology was better.