Search On 4×56Gbps High-speed Package Technology Based On HTCC

With the development of the optical communication,the demand for optical modules has increased significantly.As an important part of the optical module,the performance of the package directly affects the application of the optical module.The signal transmission rate of the package has been increased from lOGbps to 25Gbps.It’s under the background that this paper develops 4×56Gbps high-speed ceramic package applied to optical communication.Differential pairs are used in the high-speed signal transmission structure to ensure signal integrity.In vertical transmission,face via is used to replace the traditional differential vias.By analyzing the frequency domain characteristics and time domain characteristics of the port,a single channel can transmit 56Gbps high-speed signals,which verifies the advanced performance of the face via structure.Firstly,the four-channel structure of package is realized by designing the compensation corners,and then the materials are selected through thermal performance analysis and stress analysis.Finally,according to the structure of the package and the HTCC process,design the corresponding process route and carry out special research on high-precision printing and other processes to realize the preparation of the package.While the reliability of the package is guaranteed,It can also achieve isolation≥30dB and support high-speed signal transmission rate of 4×56Gbps.In the test of the signal transmission performance of the package,the probe test method with higher test accuracy was selected.The frequency domain characteristics of the package are tested by VNA combined with GSSG differential probes.The test results of S-parameters are close to the simulation results,and the single port is at a bandwidth of 35GHz,SDD11 ≤-18.8dB,SDD21≥-0.88dB,under 40GHz bandwidth,SDD11≤-11.9dB,SDD21≥-1.48dB.The most high-speed signals can realize the transmission rate of 56Gbps in the port in this paper.This paper combines design and technology to develop 4×56Gbps high-speed ceramic package applied to optical communication.Which will be beneficial to the improvement of the signal transmission rate of optical module.Provide technical support for the further development of high-speed package and high-speed circuit.