Effect Of Sealed Gas Content On The Performance Of TR Module And Its Control

With the development of radar technology,active phased array radar with multi chip T / R module has attracted more and more attention and has been widely used.In the multi chip T / R module,the circuit assembly is complex,the cavity volume is large,the internal components and polymeric materials are used more,and the internal atmosphere control is difficult.The residual atmosphere has great influence on the performance,life and reliability of the chip.In China,the harm of water vapor in the module cavity has not been paid enough attention and effectively controlled in China.The oxygen content of water in the device is high,and the module is prone to failure during operation and storage.It is an urgent problem to be solved that directly threatens the reliability of devices.The purpose of this study is to understand the current situation of water vapor in domestic military sealed semiconductor devices and its influence on reliability.The effective test methods to reveal the harmful atmosphere inside are discussed,and the main ways to reduce the influence of water vapor and improve the reliability of devices are sought.The purpose of this paper is to understand the current situation of the internal atmosphere content of sealed T / R module and its influence on the reliability,to explore the effective test control method to reveal the problem of internal harmful atmosphere,and to seek the main ideas to reduce the harmful atmosphere content and improve the reliability of the device.The work and main research results are summarized as follows:1.By comparing the level of packaging and quality control at home and abroad,it is known that the research on reliability control in China started late.However,through the analysis,research and test of internal atmosphere content on T/R module,from the packaging conditions,internal materials and material treatment process,the internal atmosphere quality has made a significant breakthrough.And this paper from the source to understand the T/R module link layout and assembly process,packaging air tight form to explore different packaging methods.The type and quantity of outgassing of epoxy adhesive material is not only related to the initial selection of the material,but also depends on the curing and aging process.The design and implementation of the test sample are introduced and demonstrated in detail.2.The paper calculates the size of the test sample,analyzes the gas exchange capacity inside and outside the test chamber and the amount of epoxy material,and determines the pressure maintaining test conditions and leakage detection conditions.The atmosphere content in the chamber of the test sample is obtained by planning the control test,and the two atmospheres affecting the reliability and performance of the T /R module are found to be hydrogen and water vapor respectively.3.Using the test software to analyze the test data,it is found that water vapor leads to aluminum metallization corrosion on the inner surface of the test sample,and hydrogen causes the degradation of Ga As devices in accelerated life test.Based on the mechanism of gas adsorption capacity decline at high temperature,the economic and applicable test conditions are found under the condition of satisfying the reliability.