Research On Silicon Chip Pyrolysis And Degradation Technology

In the era of rapid economic and technological development,a wide variety of electronic products have appeared in people's lives.These electronic products are widely used in communications,military industry,education,and medical care.For tedious and mechanical work,electronic products can help people reduce workload and time cost,and facilitate daily life.As electronic products are constantly being updated,there will be a large number of waste electronic devices.These waste electronic devices not only take up space,pollute the environment,but also bring information security issues.Therefore,the chips in these electronic products need to be processed.Currently,most chips are made of silicon materials.At room temperature,the stability of silicon materials is very good,and the degradation is carried out by hydrolysis,and the required degradation time is too long.In response to the above problems,this paper proposes a method of introducing external force to crack the chip,and then on the basis of the wet etching method of silicon,the degradation of the chip is studied by adding ultrasonic assist,applied voltage and light assisted methods.The main research contents are as follows:In this paper,the silicon chip is cracked based on the water trigger and the introduction of stress,and the force generated by the filler is optimized on the basis of filling a water-absorbent resin with good water absorption performance and a large change in volume.After adding three layers of compressed fibers,the water-absorbent resin has the best water absorption effect,and the force generated is 3 times that of the unoptimized one.In order to make full use of the limited filling space,water absorbing resins of different particle sizes are mixed and used.The weight ratio of the water absorbing resin with small particles to the water absorbing resin with large particles is 1:4to produce the maximum force.A small steel ball is placed above the filler to concentrate the stress and achieve the purpose of chip cracking.After the chip is broken based on water triggering,it takes a long time for the chip fragments to degrade in the water.In the latter part of this article,on the basis of wet chemical corrosion of silicon,the degradation of silicon wafers is studied by adding auxiliary conditions such as ultrasonic assistance,applied voltage and light,to explore the influence of different factors on the degradation rate.Among them,temperature is a very important factor.The higher the temperature,the more violent the reaction and the faster the degradation rate.When the concentration of the etching solution is 40 wt%,the degradation rate is the largest.Adding isopropanol to the solution can increase the degradation rate.When the content is 8 %,the degradation rate is the maximum.When the content of isopropanol exceeds 8 %,it will change the roughness of the silicon surface and reduce the degradation rate.When light-assisted electrochemical corrosion is used,the wavelength of light has an impact on the degradation rate.When the wavelength of light exceeds the intrinsic absorption long-wavelength limit of silicon,that is,greater than 1100 nm,illumination has no effect.Irradiation with short-wavelength and high-energy violet light will affect the surface roughness,and the degradation rate will be lower than the rate when no light is added.When irradiated with white light in the wavelength range of 400 to 1100 nm,the degradation rate is higher than that without light.The greater the light intensity,the greater the degradation rate.