| With the rapid development of monolithic integrated circuit(MMIC)technology and multi-chip module(MCM)technology,countries around the world have listed millimeter wave technology as the leading scientific research direction.The W band is near the atmospheric window with small attenuation,and has the advantages of fast transmission rate,large available bandwidth,etc.,and can realize high-frequency wireless communication.In this paper,based on integrated circuits,multi-chip micro-assembly technology is used to design a W-band integrated transmitting component that integrates miniaturization and planarization.First of all,the development of W-band integrated transmitting components at home and abroad was investigated.The main advantages and disadvantages and performance parameters of two commonly used orthogonal modulation transmitters were analyzed.The design scheme of the W-band integrated transmitting components was determined according to the performance indicators,including the design of the local oscillator module,the W-band power synthesis module,and the design of the entire RF link.Then analyze the active circuit of the W-band integrated transmitting component first,and introduce the working principle and technical indicators of the frequency doubler,low noise amplifier,drive amplifier and power amplifier,and then select the appropriate chip based on this,and Describes the performance indicators and advantages of each chip.Then,the passive circuit in the W-band integrated transmitting component is analyzed theoretically.The W-band microstrip-waveguide transition structure,the U-band local oscillator band-pass filter,the Wband RF band-pass filter,and the W-band power division are designed and simulated.The Wband power divider includes H-plane-dual-probe-waveguide power combiner,SIW-T / Y type power divider and improved high isolation Y type power divider.After physical tests,the final test results of the passive components designed above meet the performance requirements of the transmitting components.Finally,the power supply circuit and RF circuit of the up-conversion module and power synthesis module of the W-band integrated transmitting component are integrated and designed.Combining the LO and IF input interface with SMA,the RF output interface with rectangular waveguide WR-10,the power supply through the through-capacitor and the requirements of the compartments of each module circuit,the cavity of the final transmitting component is designed.The multi-chip micro-assembly technology is used to realize the interconnection between the MMIC chips.After the overall equipment and testing,the W-band integrated transmission module designed in this paper can output 84 GHz ± 1GHz RF signals,and the final output power can reach 34.8dBm. |
