The Research Of IU Matching For ASML Based On NIKON OPC Modle

The lithography process is shortly expressed as a technology to transfer the designed pattern to the surface of wafer in IC(integrated circuit)manufacturing.As the core technology of the manufacturing process of integrated circuit,more accurate for pattern precision with restricted line width size.Now the FAB in China always constrain running the same production on the same type tools for the good accuracy In order to expand the production capacity,our FAB bought ASML PAS 5500/800 Scanner to do lithography process.For the scanners in our FAB are NIKON S206 D,the 140 nm production reticle are all corrected by OPC based on NIKON model.It is impossible to make another reticles based on ASML PAS 5500/800,so through the optimize of the illumination condition,we want to make the ASML PAS 5500/800 optical model matched wait NIKON S206 D optical model at 140 nm Matel Layer by using NIKON OPC reticle.The main content: First research the change rule of the ISO and Dense CD on ASML PAS 5500/800 by different Illumination Coherence.Through the research of Illumination Coherence?exposure dose and focus,make the ASML PAS 5500/800 optical proximity correction curve matched with NIKON S206 D optical proximity correction curve.Achieve the goal that illumination condition of ASML PAS 5500/800 matched with NIKON S206 D.Then ASML PAS 5500/800 can run 140 nm production instead of NIKON S206 D after confirming the production wafer yield.It provide the theoretical foundation for running other production by different scanners in the production line.