Coexistence And Crosstalk Analysis In RFIC MCM Package

With the development of integrated circuits,the integration of RF circuits requires higher density and smaller size,and lower cost.MCM is very suitable for packaging with RF chips due to its high density.In the process of multi-system multi-band integration,crosstalk and coexistence problems will inevitably occur.On the basis of reading and summarizing a large number of documents,this paper summarizes the analysis of the previous problems of the problem,sorts out the design of the verified hardware system and test system from the process,and summarizes the problems that need to be paid attention to in the test system.A process case for verifying the coexistence test is given.From the perspective of system,the mechanism is analyzed and the measures of package optimization are summarized.According to the project,effective and executable measures are put forward.The feasibility of the optimization measures is verified by specific experiments.The paper gradually determined the common current loops of the two systems through experimental means and found the bottleneck of the interference problem.The Wi Fi interference FM problem optimizes the bonding wire modification of the QFN package A chip at the worst frequency point by about 20 d B.By adding the FM short antenna through the capacitor grounding,an additional 2 d B improvement can be get,which is based on the BGA package B chip.Modification of the substrate traces resulted in an improvement of approximately 30 d B.In the process of dealing with the BGA package C chip problem,measures such as defects were used,which increased by about 10 d B.The experiment proves that the treatment measures are effective,providing guiding data support and improvement direction for the improvement of the next version of the chip.