Crosstalk Research And Design Optimization In 3D Chip

With the development of semiconductor technology,the problem of interconnection and power consumption limits the reduction of chip size.The three-dimensional integrated circuit based on TSV can provide high-density connection and high-speed transmission.However,with the decrease of pitch,the signal integrity problem among high-speed TSVs becomes more and more serious.So recently how to suppress crosstalk in 3D high-speed integrated circuits becomes the focus of research.This paper studies crosstalk suppression in 3D high-speed integrated circuits,and the following tasks have been mainly completed.Firstly,a model of TSV is established by using an electromagnetic field simulation tool,and the crosstalk noise between the adjacent TSVs is simulated and analyzed.Based on the results of simulation analysis,a design method of crosstalk suppression using differential transmission signal instead of Ground TSV is proposed,and the feasibility of this method is verified.In addition,a simplified TSV crosstalk suppression model is proposed.Secondly,based on the proposed crosstalk suppression design method and simplified model,the crosstalk of each position in the TSV array under different topology is analyzed.The optimal design method is proposed,and the best differential TSV arrangement scheme in TSV array is obtained.Finally,a simulation environment is established to evaluate the effectiveness of using differential transmission signals in frequency domain and time domain.The frequency domain simulation shows that the design method which is proposed in this paper can suppress crosstalk.In time domain simulation,the signal integrity is analyzed by eye diagram,and the performance of crosstalk suppression by inserting Ground TSV and using differential TSVs is compared.The simulation results show that the shielding effect of Differential TSV array is similar to that of Ground TSV under the Ground TSV insertion scheme in this paper.The eye height of differential TSV array is 21.8% better than that of single-ended TSV array,and the eye width is 1.32% better than that of single-ended TSV array.The results show that the proposed crosstalk suppression design method can be applied to the design of 3D chips,which can reduce crosstalk problems and improve the performance of interconnection.