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Design And Integration Of Vehicle Inverter Based On Double-sided Cooling Power Module

Posted on:2022-07-27Degree:MasterType:Thesis
Country:ChinaCandidate:Y YuFull Text:PDF
GTID:2492306536972019Subject:Electrical engineering
Abstract/Summary:PDF Full Text Request
As the core component of power electronic converters,power modules are widely used in electric vehicles and various new energy systems.With the continuous development of electric vehicles and new energy technologies,as well as the competition in the third-generation semiconductor market segment,the requirements for power modules are getting higher and higher.The traditional single-sided cooling package module can no longer meet the increasing requirements of the environment and the market,so the third-generation double-sided cooling package module has been developed.Compared with the traditional single-sided cooling package,the double-sided cooling package has low inductance and low thermal resistance.So overall module performance has been improved.In the design of low-inductance bus capacitors of inverters,a theoretical model of integrated capacitors is established for the integration of low-inductance capacitors in double-sided cooling modules.And multi-terminal overlapping design strategy and general means of optimizing the parasitic inductance of integrated capacitors are proposed.In terms of inverter low-inductance design,low-inductance integrated capacitors are designed for double-sided cooling modules.A multi-terminal coincidence design strategy and a general method for optimizing capacitor parasitic inductance are proposed.This paper studies the parasitic inductance model in detail,design characterization method and comparative evaluation analysis of integrated capacitors.Using the finite element analysis method,the current distribution law of the integrated capacitor is revealed,combined with the switching press of the power device.The parasitic inductance model of the integrated capacitor is established.For single-ended and multi-terminal integrated capacitor structures,six terminal layout methods of integrated capacitors are given.And the parasitic inductance distribution rules of integrated capacitors are revealed.Finally,the comparative test results of the experimental prototype and the commercial product are obtained,which verified the feasibility and effectiveness of the model and method.In terms of the thermal management optimization of the inverter,the physical meaning of the thermal resistance of the double-sided cooling power module is explained.The thermal circuit model of the double-sided cooling power module is established.And the thermal resistance test results are obtained.Under the concept of isothermal profile and temperature gradient,this paper reveals the thermal mechanism of the power module,and explains the physical meaning of the thermal resistance.This paper establishes the thermal circuit model of the double-sided cooling power module.The thermal resistance laws of dual-channel heat transfer and single-channel heat transfer are analyzed.Simulation and experimental results verify the feasibility and effectiveness of the proposed model and test method.Based on the aforementioned research results,an aired-cooler is designed based on double-sided cooling module.An improved air-cooled multi-cavity cooler is proposed by 3D printing manufacturing technology,and the integrated inverter is tested.In this paper,the thermal resistance boundary value of the cooler is calculated by the inverter thermal resistance model.Based on the now more mature 3D printing manufacturing technology,an improved air-cooled multi-cavity cooling is proposed.This paper analyzes the relationship between the heat transfer coefficient and the thermal resistance of the cooling.Then it establishes a mathematical thermal resistance model,and obtains the cooling parameters optimized for quality and thermal resistance.Finally,the proposed air-cooler is verified by simulation and experimental results.The advantages and rationality of the system have certain guiding significance in optimizing module cooling,system lightweight,and mechanical production.
Keywords/Search Tags:Double-sided cooling module, Low-inductance integrated capacitor, Thermal resistance, Cooler
PDF Full Text Request
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