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Preparation Of Aluminium-based Bond Diamond Grinding Wheel And Its Application In Grinding Of Silicon Crystals

Posted on:2022-12-10Degree:MasterType:Thesis
Country:ChinaCandidate:Z S ShaoFull Text:PDF
GTID:2491306770993429Subject:Electric Power Industry
Abstract/Summary:PDF Full Text Request
In terms of fine grinding of silicon crystals,resin-bonded diamond grinding wheels have high grinding precision,but their grinding quality is unstable,and their wear resistance and self-sharpening are poor,requiring frequent dressing and reducing production efficiency.Therefore,a new aluminum-based bond diamond grinding wheel was developed in this paper for the fine grinding of silicon crystals,aiming at improving the wear resistance and self-sharpening of the grinding wheel,and improving the production efficiency.In this paper,the formula of aluminum-based bond diamond grinding wheel is designed through theoretical analysis,and the composition and proportion of the formula and the process parameters of sintering(sintering temperature,sintering pressure,holding time)are optimized.The Rockwell hardness,flexural strength and sandblasting hardness of the aluminum-based binder sintered body are taken as the main basis for judging the quality of the performance,the composition and proportion of the formula and the sintering process parameters were adjusted.Finally,the optimized formula and optimized sintering process parameters are obtained.The fracture morphology of the aluminum-based binder sintered body was observed by scanning electron microscope,and the change rule of fracture morphology under different formulations and sintering process parameters was summarized.The formula and process parameters are adjusted by analyzing the sintering quality of the section and the melting uniformity of each material.The prepared aluminum-based bond diamond grinding wheel was subjected to a grinding test,and the grinding parameters,the current in the grinding process and the surface roughness of the workpiece after grinding were recorded.The data were compared with the grinding data of resin-bonded diamond grinding wheel,and the performance of the prepared aluminum-based bond-based grinding wheel was analyzed.The wear pattern of the grinding wheel after grinding was photographed by electron microscope,and the wear pattern of the aluminum-based grinding wheel was analyzed.The MATLAB programming analysis software was used to write the code to analyze the signal of the sound file recorded during the grinding wheel grinding test.The waveform diagram and time-frequency-energy three-dimensional diagram of grinding sound signal are obtained.And compared with the image obtained by the grinding sound of the resin grinding wheel,the performance difference between the aluminum-based grinding wheel and the resin grinding wheel was analyzed.
Keywords/Search Tags:Aluminum based binder, Sintering parameters, Diamond grinding wheel, Single crystal silicon grinding
PDF Full Text Request
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