| LTCC technology is a new material technology developed by Hughes company in 1982.It is to make low temperature sintered ceramic powder into raw ceramic belt with accurate thickness.On the raw ceramic belt,the required circuit patterns are made by drilling,grouting and slurry printing,and several passive components(such as low capacitance capacitance,resistance,filter,impedance converter,coupler,etc.)are embedded in multilayer In the ceramic substrate,the inner and outer electrodes can be respectively made of silver,copper,gold and other metals,sintered at a certain temperature to make a high-density circuit board with no interference in three-dimensional space.IC and active devices can be mounted on the surface to make passive per active integrated functional modules.The circuit can be further miniaturized and high-density,and can be used for high-frequency communication Pieces.Various high-tech LTCC products can be successfully manufactured by using this technology.There are many ways to integrate passive components with different types and performance into one package,including low temperature co fired ceramic(LTCC)technology,thin film technology,silicon semiconductor technology,multilayer circuit board technology,etc.LTC technology is the mainstream technology of passive integration.LTCC integrated components include products with various types of active or passive components carried or embedded in various substrates.The integrated components product project includes components,substrates and modules.The laminating machine is the key equipment in LTCC multilayer substrate manufacturing line,which is located in the back of printing process and the front of laminating process.It mainly completes the lamination of the raw porcelain pieces after printing.The input of the device is a single piece of raw porcelain,and the output is a set number of layers of stacked green porcelain blanks.The automatic lamination process is mainly composed of raw porcelain cleaning,raw porcelain piece alignment,raw porcelain chip transportation and other processes.The main functions of automatic lamination process include: automatic raw ceramic chip feeding,cleaning,overturning,transporting,dispensing,laminating,blanking,etc.PLC is used to control,the movement mode is mainly completed by motor screw,cylinder,etc.the alignment system adopts double CCD image alignment. |