Development Of Small Diameter Soft Abrasive Grinding Tool And Research On Its Chemo-Mechanical Grinding Mechanism

With the rapid development of science and technology,the demand of monocrystalline silicon,quartz glass and other hard and brittle materials in the use of micro and small parts is expanding rapidly.At the same time,the requirements of dimensional accuracy and surface quality are gradually improving.The current micro grinding technology has been able to process silicon-based micro complex structure parts,but there are still some problems,such as poor surface quality,low service life of grinding tools,low processing efficiency and so on.Therefore,the purpose of this paper is to solve the problems of monocrystalline silicon processing crack,serious edge collapse and poor surface quality through chemical mechanical synergistic coupling,put forward the method of chemical mechanical grinding of silicon-based micro hard brittle materials,develop the special soft abrasive small diameter grinding tool for chemical mechanical grinding,and analyze its grinding performance and grinding mechanism,The specific work of this paper is as follows:(1)According to the characteristics of hard-brittle materials of monocrystalline silicon,the small-diameter soft abrasive tools with different formulations were designed by using single factor change design method with ceria and magnesium oxide as abrasive.The corresponding hot pressing die was designed.Simultaneously,the manufacturing process of small-diameter soft abrasive tools was formulated,and the formulation was optimized through monocrystalline silicon grinding test.(2)The small-diameter soft abrasive tool was used to grind monocrystalline silicon.The ground surface morphology,surface roughness and material removal rate were used as evaluation indexes to compare the effects of different components and their content on the grinding performance.The experimental results show that the high quality surface with Ra=1.332 nm can be machined by the self-made small diameter soft abrasive tool.The effect of external temperature field on the material removal rate of chemo-mechanical grinding of monocrystalline silicon with small diameter soft abrasive tools was investigated by friction and wear tests.(3)Considering the solid-solid chemical reaction between soft abrasive and monocrystalline silicon,the contact deformation between soft reaction layer and soft abrasive,the motion relationship between self-made soft abrasive tool and workpiece,and the instantaneous removal volume of abrasive particles,the grinding force model of contact area in soft abrasive chemical mechanical grinding is established,and the correctness of the model is verified by experiments.The experimental results show that the plastic deformation has a great influence on the tangential grinding force,and the friction between the grinding tool and the workpiece plays a leading role in the grinding force.(4)The temperature distribution of single crystal silicon grinding with a small diameter abrasive tool made by ourselves is simulated by finite element method by ABAQUS.Laser confocal Raman microscope was used to detect the surface and debris of silicon wafer after grinding.According to the detection results,the solid-solid chemical reaction between abrasive,additive and silicon wafer was analyzed.The results show that the removal of silicon wafer by self-made small diameter soft abrasive tools includes chemical reaction and mechanical removal.The material removal model of small diameter soft abrasive tool for grinding silicon wafer is established.