| Sapphire single crystal has wonderful thermal character, electrical properties, higher transmittance, wearing quality and higher hardness. Therefore, it widely be used in large screen colorful display, special lighting, traffic signal, optical communication fields et al . It's also the idea substrate material for high performance semiconductor chip, at the same time it extensively be used in military field as the window material for infrared receivers and sensors.It has the high demand in surface processing precision and surface integrity not only in micro-electronics and photoelectron fields, but also as the detect window material. The Mohs hardness of sapphire single crystal is 9, so it's difficult to processing. Loose diamond abrasive lapping have the low efficiency, abrasive large consumption, high processing cost and cause severe surface/subsurface damage. The final CMP processing also have the low efficiency, and it's difficult to handle the alkalescency or acidity slurry.The paper proposes the sapphire substrate soft abrasive grinding wheel processing method aiming at the problems in processing. The grinded sapphire substrate not only has the surface processing precision and high efficiency, but also the low damage surface. According to sapphire's physicochemical characteristics, the paper optimized select the compositions of soft abrasive sharper, design the soft abrasive shaper formulas and structure, research the shaper processing technology, develop the two different main material lapping plate. Study the kind of abrasives, lapping plate speed, lapping pressure influence on processing quality. Based on this, improve the soft abrasive grinding wheel formulas, and design the structure of soft abrasive grinding wheel, manufacture the two different main material cup-type soft abrasive grinding wheel, carry the match experiments using the diamond grinding wheel in same mesh, study the grinding performance of soft abrasive grinding wheel. The test indicate that sapphire substrate can achieve super-smooth, low damage processing surface and high material removal rate by soft abrasive grinding wheel. |