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Study On Failing Model Of LED Light PCB Reflow Soldering

Posted on:2016-08-16Degree:MasterType:Thesis
Country:ChinaCandidate:J LiuFull Text:PDF
GTID:2481304808989109Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
At present,the technology of surface mount and reflow soldering has become the main production technology in the electronic products manufacturing industry in China.The quality of the reflow soldering of electronic components not only directly affects the bad rate of the electronic products,but also affects the performance and service life of the electronic products.In this paper,the author studies the key influencing factors of LED light PCB reflow soldering and the improvement method and measure.It is aimed at reducing the bad product rate of reflow process and improving the quality of products and customer trust.The main contents are as follows:First,according to the actual reflow process of electronic products,the statistical analysis of the adverse rate of return flow in the same batch,the same product with different batches,different batches of different products.The failure rate 1676 PPM were analyzed by using two distribution maps,and the main failure modes of the reflow soldering were determined: air welding and migration,and the failure mode analysis was carried out.Secondly,the paper introduces the analyzing tools: measurement system analysis,fishbone diagram,cause and effect matrices,failure mode analysis and other related failure modes.According to the data analysis and objective requirement of the actual production,the corresponding data analysis is carried out by using appropriate analysis method,and the data processing is realized by Minitab software.On this basis,the main factors that affect the quality of the product are analyzed and found out,such as: blade pressure,wipe frequency,etc… And the method of improving the welding quality is put forward.Thirdly,the factors that affect the quality of reflow soldering are analyzed and classified,and the factors that affect the cause and effect are given directly.According to the analysis results,the improvement measures are given.Finally,by improving the data contrast,the printing station's process capability CPK from 1.13 to 1.64,the production rate dropped to 299 PPM,verify the effectiveness of the improvement measures.The research of this thesis not only improves the quality and customer trust,but also saves the cost of production equipment and measuring instruments,and has a practical guidance to the production process of the company.
Keywords/Search Tags:Reflow Soldering Technology, failure model, FEMA, DOE
PDF Full Text Request
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