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FEM Analysis And Structure Optimization Of Electrode Of Hot-pressing Reflow Soldering

Posted on:2012-09-03Degree:MasterType:Thesis
Country:ChinaCandidate:L S MiaoFull Text:PDF
GTID:2211330371952218Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
Hot-pressing reflow soldering is a welding method based on reflow soldering and bonding. The workpiece is abutted to the electrode by the clamping force transferred by the electrode. The joule heat produced by the heated electrode passes through the abutted surface into the joint and causes the melt of preset solder. The process of reflow soldering achieves between the slender wears and the metallic coat.The temperature distribution of the working face which is a crucial influencing factor to the weld quality of hot-pressing reflow sodering is related to these influencing factors including workpiece diversity, different electrode structures and materials, current form and radiation. With the development of lead-free solder alloy, more strict technological parameter is demanded, which requires more better uniformity to the acting face. This paper designs infrared detecting experiment to get the thermograph during the heating process of electrode. The electrode temperature distribution simulation is achieved based on ANSYS. The continuous between each step of the solution process is achieved under the controlling of APDL program.The comparison between simulation result and the thermograph proves that simulation of the electrode is feasible.Based on the FEA model, several crucial property criterion of the acting face temperature distribution is established and a simple factor comparison system is designed to determine the optimization electrode. The effect of reflow soldering heating rate and reflow temperature on electrode temperature distribution is analysised under the optimization electrode model. The influence law of crucial structure size, reflow soldering heating rate and reflow temperature is obtained. The comprasion between optimization electode and initial electrode shows that the temperature distribution has been apparently improved.The FEA model of hot-press reflow soldering electrode based on ANSYS can simulate the temperature distribution in electrode effectively. The research achieves the electrode temperature distribution visualization during design procedure and shortens the electrode design process too.
Keywords/Search Tags:Hot-pressing reflow soldering, FEA, structure optimization, electric heating simulation
PDF Full Text Request
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