Font Size: a A A

Analysis Of Photothermal Performance Of Deep-sea Non-imaging Lighting Modules

Posted on:2022-06-23Degree:MasterType:Thesis
Country:ChinaCandidate:T ChenFull Text:PDF
GTID:2480306722452114Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
The ocean covers 71% of the earth's surface,and the exploration of deep ocean areas below 6,000 meters is a frontier field to solve major scientific problems such as the origin of life and the evolution of the earth.Since natural light can only reach about 200 meters underwater,deep-sea floodlights have become an indispensable lighting equipment in deep-sea exploration and development.At present,the whole sea deep floodlight unrealized mature industrialization,mainly rely on foreign imports,combined with the relevant results obtained by foreign research institutions on deep-sea LED lights,research is focused on the lamp shell of compressive strength and seal design,design of light source module of concentrated and high-power light source module driven by heat dissipation design.In particular,high output luminous flux,high luminous efficiency and heat dissipation efficiency are the difficulties in this field.In view of this,starting from the study of light flux and heat dissipation performance of light source modules,this paper proposes a COB packaging form that has better light emission performance and pressure compensation performance of light transmission window compared with the LED lamp beaded packaging form.Based on this packaging form,light source modules with good thermal stability and low operating temperature are prepared.The main work of this paper is as follows:First of all,in order to compensate the pressure difference between the inside and outside of the transparent window and avoid the lens being broken due to different forces,the optical silica gel is used as the medium of the pressure compensation structure with the characteristics of incompressibility and excellent light transmission.Compared with the traditional hydraulic compensation structure,it has the advantages of convenient assembly and simple structure.The experimental device designed to complete the encapsulation of the bubble free silica gel and the assembly of the whole light source module.At the same time,the influence of different refractive index(1.41?1.55)and different thickness(1.6?3.0mm)of encapsulating silica gel on the light flux of the light source module was investigated,and the encapsulating silica gel with the best refractive index and encapsulating thickness was determined.Secondly,the light source module is prepared by the COB integrated package.Through steady-state thermal simulation,infrared thermal imaging temperature measurement and the establishment of thermal resistance model,the influence mechanism of different packaging structures of phosphor layer on the operating temperature of light source modules and the causes of temperature difference were studied,and the packaging mode of light source modules with good thermal stability and low operating temperature was proposed.Based on this packaging method,the influence of phosphor coating thickness on the light output performance of light source module was investigated,and the coating thickness of phosphor coating for white light source suitable for deep sea lighting was determined.In addition,the light emission performance of the light source modules of the two packaging forms is compared.Compared with the LED lamp beaded packaging,the light flux and light efficiency of the light source module encapsulated by COB are improved by20.2% and 28.3% when the input power is reduced by 6.25%,which shows that the light source module encapsulated by COB has better optical performance.Finally,in order to enhance the overall thermal performance of a light source module,within the limited space of lamps and lanterns,was prepared by plasma enhanced chemical vapor deposition method with high thermal conductivity,diamond-like films use of DLC film insulation and high thermal conductivity maximum replaces the thermal conductivity of poor substrate resistance welding white ink layer,effectively reduce the high power light source module working temperature.
Keywords/Search Tags:deep-sea LED lighting, encapsulated silica gel, multi-chip integrated package, phosphor layer temperature, diamond like carbon(DLC)
PDF Full Text Request
Related items