| The following research is a combination of thermo-mechanical analysis of a Plastic ball grid array (PBGA) package using various CAE tools. In the first part a 3-Dimensional Thermo-mechanical analysis of a Ball Grid array package for telecommunication equipments is presented. A Design tool called PAK SI-TM is used to simulate thermal, moisture and mechanical performance of a BGA package. The package is fully defined for JEDEC standard specifying die, die attach, molding compound, substrate, solder, PWB and heat sink. Appropriate boundary conditions are implemented and simulation is carried after pre-processing that includes an automatic mesh generator, In order to assess the performance of the package, attention will be focused on critical packaging issues like thermal resistance, warpage, die cracking, delamination and popcorn evaluation, Error checking and identification such as redundant dimensions is done automatically, Results will be presented using FEMAP as a postprocessor. For comparison purpose, the thermal performance of the package will be modeled using SDRC IDEAS. (Abstract shortened by UMI.)... |
