| In this report the design and the validation of the design analysis of a micro-embossing machine is presented. The design methodology involves the identification of the major subsystems in the embossing machine followed by the subsystem level design of the major subsystems (the heating, cooling and forcing system), based on the design requirements. Thermal models for the heating subsystem were created and solved using ANSYS and results were obtained. An experimental setup was devised to perform heating experiments in order to validate the finite element analysis (ANSYS) results based on which the heating subsystem is designed, The experimental results were compared with the simulation results and were documented, Cooling experiments were performed to validate the cooling system design calculations. Compression tests on Polymethyl methacrylate (PMMA) were performed over a range of temperatures and the temperature dependence of Young's modulus was documented. (Abstract shortened by UMI.)... |
