| This research investigates how thermal lamination process parameters influence the material behavior of self-reinforced dielectric film. In multi-layer PCB construction, the alignment of features is critical to the quality of the final product. As the material approaches its melting temperature, the lamination parameters can influence the amount of movement of the material. Through the utilization of a designed experiment (DOE), the effects of these process parameters have been determined; and a processing window established to minimize displacement compensation factors. Through statistical analysis, the significance of the manufacturing process on the fatigue life was determined. From this research, it was found that fatigue life of the material is significantly affected; and therefore should be considered for product development. Using the empirical data, multiple regression models have been developed to predict the future fatigue response for a range of strains and deflections. |
