| The ever growing consumer demand of smaller and better electronics has led to size reduction and addition of new features in electronic products such as cell phones, PDAs, etc. This has further created dimensional reduction and complex designs of the printed circuit board. As a result, technologies behind electronics assembly applications are facing bigger challenges to obtain a stable and high process yield.Dispensing is one of the most complex and significant processes in surface mount technology (SMT). Studies have shown a rising demand for improved dispensing technology in the electronics manufacturing industry with its ability to dispense small volumes of packaging materials. As a process engineer, the critical step towards successful small volume dispensing is to characterize the dispensing process.The study presents a detailed approach of characterizing the dispensing technology for a typical 0.100 mg fluid dispensing application. The study employs different statistical techniques ranging from experimental design (DOE) to process control evaluation to development of process development of a 0.100 mg dispensing process. |
