| This work examines the possibilities of determining the effect of various package parameters on the performance of the package. In a plastic package such as the Thin Quad Flat Package the various package parameters such as the package area, die area, die pad area, bond wires, lead finger thickness, lead finger width, lead finger pitch and leadframe downset were examined and their influence on the electrical and thermal performances of the package were determined. The design of experiment techniques such as Taguchi method and Box Behrken methods were used to setup experiments to determine the influence of the package parameters on the performance of the package. The package was modeled for both electrical performance using PACED software and thermal performance of the package was determined by using FLOTHERM. Modeling determined the extent of influence of the package parameters. Thus, this helps us understand the influence of various key factors in the performance of a package which when used will provide an optimized package. |
