| Thermal resistance of a Quad Flat Nolead (QFN) package, comprised of the bulk material resistance of a die attach with its two interfaces, is measured by thermal transient technique. Two die attach chemistries (Ag filled and Boron Nitride filled) and three die-backside coatings (TiNiAg, Au, and bare Si) were investigated to understand their contribution to the thermal resistance. Of the tests conducted, the most effective combination was a metalized layer of TiNiAg with the Ag filled epoxy system. In order to further improve the thermal resistance reduction, electron to phonon and phonon to phonon transport must be better understood. |
