IGBT Module Bonding Wire Design And Reliability Research

As the core device for energy conversion and transmission,IGBT has the properties of high efficiency,energy saving,high voltage,high current,high frequency and easy switching.It is suitable for various application scenarios that require AC and DC conversion and high and low voltage conversion,and can improve power efficiency And quality,it is widely used in consumer electronics(automotive electronics,household appliances,frequency conversion white goods)and industrial(rail transportation,smart grid,transportation)fields.Under the general trend of international energy conservation and environmental protection,the downstream areas of IGBT modules such as new energy vehicles,inverter home appliances,and new energy power generation are developing rapidly,and the demand for IGBT modules is gradually expanding.The accelerated development of emerging industries will continue to promote the rapid growth of the IGBT market.Due to the high design and process requirements of IGBT,the lack of IGBT-related technical personnel in China,the weak process foundation and the late start of enterprise industrialization,the IGBT market has long been monopolized by large foreign multinational companies.Driven by favorable national policies,China's IGBT industry has made certain technological progress,which has promoted the localization of China's IGBT.By taking the IGBT module bonding wire as the research object,based on the establishment of the IGBT module electric-thermal-force multi-field coupling model,the temperature and shear stress during normal operation and part of the bonding wire falling off are comprehensively analyzed.This thesis mainly solves the problems of current sharing and heat concentration distribution of the IGBT module flowing 50 A current.By using quantitative analysis,parameter comparison,finite element analysis and other methods,the Solid Works drawing software and the finite element simulation software ANSYS are used to simulate the bonding wire.Through comparative analysis on issues such as diameter,wire height,arc height,wire length,etc.,a design plan for IGBT module bonding wires that meets 50 A overcurrent sharing and even heat dissipation is finally obtained.The result is called this design plan.For small batch production,because the influence of the process is not considered,there is an error between the actual product and the simulation result.The reliability test is used to verify whether the designed IGBT module can meet the working requirements and life requirements,and the service life of the IGBT module is predicted based on the reliability data.To verify the design scheme of the IGBT module bonding wire.The reasonable design of the bonding wire can increase the working life of the IGBT module;the junction temperature of the chip surface and the temperature of the chip center corresponding to the bottom plate are linearly related to the number of bond wires falling off;the failure of the bonding wire falling off will not cause damage to the layer structure of the module The steady-state thermal resistance from the chip to the bottom plate is increased.The paper accelerates the working process of IGBT module through reliability test,and further studies the relationship between IGBT bonding wire failure and electrical parameters.Research has been done in theory,simulation and testing,especially the performance of bonding wires and chips is analyzed through a large amount of reliability test data,and the electrical parameters of IGBT modules are analyzed for process state detection,which provides for the rationality of the design of bonding wires.An important reference basis,and the design methods and verification schemes used have reference basis for the design of other power devices.