Research On Technology Of Surface Modification And Metallization On Polyphenyl Ether Substrate

Polyphenylene ether has attracted wide attention due to its excellent dielectric properties and physicochemical properties in recent years.It has derived many electronic products and become one of the most promising high-performance substrates.However,the inherent characteristic defects of polyphenylene ether make it unable to meet the requirements of direct metallization,and is often faced with problems such as inability to form copper layer,uneven deposition and poor adhesion,which greatly limits its application and development in the high-frequency and high-speed fields.Base on this,the thesis proposed a method of low-cost,simple operation,environmentally friendly and efficient process,which combines pretreatment and graft treatment to achieve the surface modification of polyphenylene ether substrate and then produces high-quality deposited copper layer.The main research contents are as follows:?1?In this paper,acid KMnO₄ and KOH step-by-step treatment schemes were selected from various pretreatment processes through comparative tests,and their process parameters were optimized.The optimal parameters of acid KMnO₄ treatment were 15 g/L at 45?for 30 min,and that of KOH treatment was 100 g/L at 80?for 90min.After the treatment,the surface roughness and wetting property of PPO substrate can be improved to some extent.?2?Though testing and analysis,the graft modification can make the surface roughness maintain a good wettability even when the surface roughness was greatly reduced.The optimal ultrasonic power of dopamine treatment was determined to be 300W,the optimal temperature and treatment time of coupling agent graft was 40?and 5min.?3?The copper layer was deposited on the surface of PPO substrate by chemical deposition with formaldehyde reducing agent system.Then the effects of different deposition times on the thickness and square resistance of the copper layer were studied,and the optimal electroless plating time was optimized.Though an analysis and characterization of the composition,conductivity and adhesion strength of the copper layer,it was proved that the copper layer formed by the metallization of the PPO substrate after grafting agent showed dense accumulation and good metallic luster,the crystal structure was normal,and the purity approached to 100 at%.In addition,the copper layer also has good electrical conductivity.The resistivity is only 1.63 times that of the bulk copper material.Even after a long time of shelving the resistivity is only a small increase,and the bonding strength between the metal layer and the substrate is good enough to reach the highest 5B level requirement in the standard ASTM D3359-02.