Performance Analysis Of Thermoelectric System Integrated Heat Pipe For Electronic Devices

Electronic equipment cooling system is an important factor affecting the normal work for Electronic devices.With the rapid development of electronic technology,electronic devices is moving toward miniaturization,high frequency and high encapsulation,resulting high heat flux in the interface of electronic devices.Traditional cooling technology is reaching the limits of cooling capacity and cooling efficiency for cooling demand of electronic devices.Combined with electronic technology wide applications and some special requirements,electronic devices are often applied in unconventional environment,which increases some new challenges for electronic devices.Therefore,it is very important practical significance to explore efficient,safe and economic electronic equipment cooling technology in order to meet the demand of electronic equipment heat dissipation.Thermoelectric cooling system has numerous advantages,such as environment friendly,safely,good temperature control,no mechanical movement.And heat pipe has smaller resistance,and fast heat transfer,they provide a good foundation for electronic equipment cooling technology.This paper presents the thermoelectric cooling system integrated heat pipe(TECSHP)for electronic devices,and utilizes thermal resistance method ?effectiveness-number of transfer units method?effective cooling model by theoretical analysis,numerical simulation or experimental method,on the basis of the minimum surface temperature of electronic equipment and maximum cooling capacity.It also provides a new train of thought for researchers.The main research works is as follows:Firstly,a thermoelectric basic model was analyzed and simulated calculation.In this paper,thermoelectric model was introduced in detail by a one-dimensional heat transfer model or interface thermal balance model,and has carried on the simulation calculation by using the model,analyzed the maximum efficiency and maximum refrigerating capacity.Analysis results show that the maximum cooling capacity and maximum efficiency can not be reached at the same time.In addition,due to the closely relation between thermoelectric model building and thermal physical parameters,this paper also summarizes the domestic and foreign literatures on the thermal physical parameters simplified and error analysis.It is helpful for the later research scholars.Second,a thermodynamic model of TECSHP was established,and carried out to build a multi-parameter and multi-objective synthetic equation of thermoelectric cooling by utilizing thermal resistance method?effectiveness-number of transfer units method.Based on the equations,the system performance covering with cooling capacity,surface temperature of heat source,current,thermal resistance in both sides,heat capacity,inlet temperature were analyzed.Simulation results show that the results of two methods are basically consistent,suggesting that these parameters directly affect the system performance of the TECSHP.At the same time,the paper also deduces the effectiveness-number of transfer units method and using the heat performance parameter UA to simplify the parameters of hot-side.Based on this method,the effective cooling model has been developed,which provides a theoretical basis for the thermoelectric effective heat dissipation.Finally,an experimental test platform for TECSHP was presented,and the dynamic process of TECSHP was studied.Also the dynamic characteristics of tehermoelectric operating voltage and heat spreaser were analyzed.In the paper,theoretical analysis,numerical simulation and experimental method have been considered for TECSHP and established the method of thermoelectric cooling system.Simultaneously,the thermoelectric physical parameters and effective cooling model were studied,enriching the heat dissipation theory and practical application of electronic equipments.