IC Change Kit Optimized Design Based On Function And Yield Promote

The IC change kit is a very important component in manufacture of IC test,the function is assist handler guide and location,Direct contact with IC in IC test.so the performance of IC change kit directly affects the efficiency and quality of IC test.in the process of developing IC packaging and testing,The major industrial country in the world are committed to improving the technology of IC change kit.This article base on SolidWorks Simulation and HFSS to simulate the IC change kit pusher by statics,simulate the Pogo Pin by statics,simulate the socket by thermodynamics and electromagnetic shielding,The optimal design scheme is confirmed through experiments,Finally,the performance of the pusher and yield of pogo pin&socket is improved.This topic mainly studies the following aspects of IC change kit:1.Introduction of IC change kit and testing principle,include the composition of the IC change kit,Working principle,Tester,Handler,Mounting mode,IC encapsulation,IC testing principle.2.Introduction of IC change kit the theoretical basis optimization design,First,a brief introduction to the finite element method and calculation is given,Next,we introduce the theory and calculation of IC change kit,Including force analysis and calculation of pusher,Pressure calculation of test arm in test handler,Calculation of elastic force during pogo pin compression,Calculation of electrical characteristics of socket,Calculation of pass frequency of socket,Relationship between current and temperature in Pogo Pin,Bandwidth measurement of pogo pin,Functional test for O/S test.3.The cause of abnormal bending of IC change kit pusher is analyzed,Finding the true cause of an anomaly,And provide two optimization schemes for increasing the claw thickness;The reason for the low yield of IC test Pogo pin is analyzed,The optimization design of changing the Pogo pin from single cone to four jaw crown is put forward;An analysis of the anomaly of low test yield by socket is carried out,It also provides two optimization schemes for removing copper blocks and retaining copper blocks with shim.4.Firstly,Static finite element simulation of pusher,Comparison of simulation results before optimization and two optimization schemes,And carry out experimental verification,The simulation results are consistent with the experimental results and the failure locations coincide,The feasibility of finite element method for static simulation analysis is proved,The pogo pin and IC in the test are simulated,Further experiments confirm that crown probe can improve the test yield;Thermodynamic simulation and electromagnetic shielding simulation of the socket are carried out,proved the copper block has excellent performance in grounding,heat dissipation and electromagnetic shielding,The feasibility of retaining the copper block with shim is confirmed through experiments.The significance of this study lies in the application of CAE analysis technology,The different schemes of IC change kit improvement are simulated and analyzed,and the best solution is confirmed,Reduced the number of experimental verifies,Improve the design efficiency and accuracy,Reduce cost.