Reliability Analysis And Test Study Of Printed Circuit Board

The main content of this paper is the reliability theory analysis and reliability test of the circuit board in a certain product.The project originates from actual research production demand.Firstly,the working environment of electronic equipment was classified,and the main environmental factors(namely vibration and temperature)that led to the failure of electronic equipment were analyzed and studied.The theory and method of reliability analysis are summarized.Then a one-dimensional simplified finite element modeling method is proposed to model and analyze thermal reliability of chip.Based on the comparison between the finite element model and the simplified model of the two different boundary conditions,the validity of this one-dimensional finite element method is determined.Then the prediction method of the life of the circuit board is studied.The feasibility of this method is proved by using the Mason-Coffin equation to predict the life expectancy of three different types of circuit boards.In the end,the vibration finite element simulation analysis and experimental research are carried out for the fixed mode of the installation of a circuit board,and the installation method of the four sides is selected.For a circuit board to solve the problem of the high failure rate under high temperature and working environment,has carried on the finite element simulation analysis and experimental study on the temperature,choose a feasible way of heat dissipation of target location chip cooling,and measured the failure rate fell by 50%in the process of actual use.