Printed Circuit Board And Integrated Circuit Components, Modal Analysis And Vibration Reliability Study

Vibration reliability of electronic equipment is one of the research emphasis inthe aerial electronics industry. According to statistic, vibration is more than 27% inthe factor resulting failure of electronic equipment, and printed circuit boardsassembly (PCBA) is the focus of vibration problem. In vibration environment, thePCBA is so sensitive to vibration that influence holistic equipmentModal analysis technology is the most important means to obtain structuredynamic properties. It come of early of 80 ages, and has maturated in the development20 years. Together with finite element (FE) analysis, they have become the twobackbones of structure dynamics. And they have been applied widely in mechanicalengineering, aviation and spaceflight and electronic industry. Dynamic propertiesinclude natural frequency, vibration model shape and damping ratio etc. Accordingwith these dynamic properties, we can process optimal design, troubleshooting,reliability analysis and estimate.From the point of circuit and system, discarding the boundary between electronicand mechanical, combining with modem modal analysis technology, a series ofresearch was processed to the vibration reliability problem of one digital processingPCBA installed in one satellite. Firstly, we researched FE modeling methods of thePCB, and, the FE modal of PCBA was set up. Subsequently, modal analysis wasprocessed to this FE modal applying ANSYS software. And it figured out its dynamicproperty parameter. By contrasting with the result of experiment modal analysis, itwas indicated that the FE modeling methods was reasonable. Experiment modalanalysis is the exclusive methods of obtaining the actual structure dynamic property.Recur to the dynamic signal analyzer of DP cop. of USA, We processed Experimentmodal analysis to the PCBA, and obtained its actual parameter of dynamic propertyincluding natural frequency, modal shape and damping ratio etc. these result wasgrounded for troubleshooting, optimal design, reliability analysis and dynamicimprovement. At the same time, the analysis of vibration signal and the methods ofpick-up parameter was researched.Based the result of modal analysis, the weakness of PCBA was found, andanti-vibration measure was put forwarded, this PCBA was processed dynamicmodification based in sensitive analysis. So, the PCBA was redesigned and fabricated.Result was very good. Its anti-vibration property was improved largely. And, it passed...