Study On The Design Technique Of Super Compact Multi-Stage Wilkinson Power Divider

The conventional power divider,which is based on the distributed parameter structure,can achieve a great performance of insertion loss,but it still can not satisfy the miniaturization requirement of the high density microwave system.Usually,to get a smaller size,the lumped element equivalent circuit,which is based on the?/T-Type Structure,is adopted in the design of power divider.But,due to the restriction of bandwidth of equivalent circuit??/T-Type?,the miniaturization technology mentioned above can not be used in multi-stage power divider design,for the application of ultra-wideband systems.In view of the situation mentioned above,this paper focuses on the design technique of ultra-miniaturized multi-stage power divider to achieve the performance combination of miniaturization and ultra-wideband for the future system.The main works and innovations of this paper are as follows:1.The model of hybrid coupling T-type equivalent circuit model based on lumped parameter for the transmission line is studied.Simulation shows the result that the model achieves good equivalence to transmission lines within the frequency range of ultra-broadband.In consequence of this,the electromagnetic hybrid coupling T-type transmission line is adopted to design lumped equivalent circuit model of four-stagy Wilkinson power divider.Finally,a good performance lumped parameter circuit model of ultra-wide band power divider is put forward.2.Based on the circuit model proposed above,a super-miniaturized Wilkinson power divider with working frequency range between 2G²2GHz is designed by using thin film IPD technology.The return loss of the proposed power divider(S₁₁)is less than-15dB,the insertion loss(S₂₁)is less than 2.5dB,and the isolation(S₃₂)is greater than 15dB.The physical area dimension is1.7mm×0.9mm?0.068?₀×0.036?₀?.3.Through the study on application of power divider in the system,an architecture of super compact power divider with amplitude equalization capability is presented.Based on the thin film IPD technology,this architecture realizes the efficient integration of power divider and equalizer within the size of 2.1mm×1.8mm?0.084?₀×0.072?₀?.At the level of power divider link,it provides a good solution to amplitude equalization for system.