| Silicon-based material is recognized as a promising material for the advanced engineering application and semiconductor industry.It has excellent features such as high-temperature strength,high elastic modulus,low coefficient of thermal expansion,and chemical stability.The conventional method of mechanical polishing or grinding is not stable for optics lens or the advanced component which need the ultra-precision surface,because this conventional method will leave surface damage on the sample.For these reasons,noncontact polishing methods have been developed This thesis introduces atmospheric pressure plasma polishing(APPP)technology which allows for polishing without surface damage with high accuracy.It is found that temperature can influence a chemical reaction base on the Arrhenius equation.This chemical reaction leads to a removal amount in processing of APPP.In this thesis,the relationship between removal amount and temperature has been investigated and the result has shown as a removal function.The material removal function was made by comparing the removal shape according to each different temperature by etching for the certain time.After obtaining removal function,we are able to predict a removal shape at any specific temperature and predict the polishing time in simulation.This thesis can present total polishing time related to temperature in simulation,using this material removal function with Lucy-Richardson algorithm and also the method for minimizing the edge effect which is inevitable phenomenon during the polishing process will be discussed.This thesis provides the relationship between removal function and temperature,during the APPP process and verified by theoretical simulation and experimental analysis.This experimental investigation can be used in.I hope those who work in the semiconductor industry,high precision processing industry,or researcher can get benefits through this thesis of experimental research. |
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