Mechanism Analysis Of Flexible Electronics' Curved Conformal Deformation Process And Similarity Comparison Criterion

The flexible electronics has the characteristics of large area,light weight,non-planarity,and easy deformation.Compared with electronic devices based on planar substrates,the transfer printing integration process of flexible electronics on structures such as large-area,large-deformation,and complex-curved surfaces has greater advantages.However,there still exist some process difficulties such as transfer printing on object surfaces and conformal deformation.This paper,researches on the flexible films such as flexible electronics,and carries out its transfer printing process,mechanism analysis of its conformal deformation,similarity comparison modeling and experimental research work.The details are summarized as follows:Firstly,put up three curved transfer printing schemes.Chose the active and passive combined transfer printing scheme via point interpolation,and made a detailed structure of manipulator.Simulated and computed the suckers' vacuum degree.Secondly,conducted pose transformation matrix of the object surface to minimize the whole deformation of flexible electronic film.Established the mechanical model of flexible films' surface deformation via point interpolation based on the minimum potential energy.And calculated the optimal model through genetic algorithm.Then,researched the 3D curved surface similarity comparison using spatial structure circular descriptor based on geometric features histogram.Using the spatial structure circular descriptor,this paper projected the 3D points cloud into 2D plane,and were segmented in some regions,got each feature statistics matrix,and their similarity comparison model.Using Kuhn-Munkres algorithm to match each region,this paper established a similarity criterion for the entire 3D surface.Finally,established the curved transfer printing process platform and the manipulator,measured and calibrated related key parameters.Experiments were carried out to test the conformal deformation of the flexible film according to the experimental platform.The 3D point cloud of the deformed surface of the flexible film under 9-point interpolation was scanned,and the similarity between the deformed surface and the target surface and the mechanical modeling simulation surface was measured.Through the experiments,the proposed conformal deformation process of the flexible film via based on point interpolation and the surface deformation model based on optimal potential energy were verified.The flexible film curved surface conformal transfer process studied in this paper and the mechanical model of flexible films' conformal deformation via point interpolation based on the minimum potential energy have been implemented and verified on the flexible curved electronics conformal preparation platform,and that also provide a certain reference significance of related flexible objects on picking,transfer,deformation and placement operations.