Study On Conductivity Enhancement Of Silver Interconnect Based On Nanoimprint

As one of the next-generation pattern transfer technologies,nanoimprinting stands out due to its low cost,high output,and high fidelity.The nanoimprinting technology based on the pseudoplastic silver nanoparticle fluid is a process technology of simple process,directly imprinting metal lines,and fast low temperature and little damaging to the substrate.At the same time,there are still many problems in silver interconnect obtained by low-temperature sintering of silver nanoparticles,their electrical conductivity and mechanical property still needs to be improved so that integrated circuits have higher speeds.In this paper,the conductive properties and mechanical properties of silver interconnections obtained by low-temperature sintering are improved by doping with other metal particles?nickel,titanium,chromium,cobalt,molybdenum,etc.?and using electrostatic field-assisted during heat treatment.This article confirms the reliability of our ideas through a large number of experiments.First of all,in order to find out other metal nanoparticles that can enhance the conductivity of the silver interconnects,taking into account that different levels of conductivity enhancement,different types of metal particles are added to the silver nanoparticle solution Metals with modulating effects were screened.After measurement and characterization,it was found that the most conductive interconnects were obtained at a concentration of 5%of Ni.The resistivity was 4.74×10^-8?·m,which was optimized by 26.5%than the un-doped.Using the XRD,it was found that the trend of grain size coincides with the measured resistivity.However,From the AFM and SEM,it was found that the surface morphology did not change much,following study is still underway.An external electrostatic field is used to assist the sintering during the sintering process in order to optimize the conductivity and surface morphology.With the increase of the electric field strength,the surface voids are significantly reduced,the undulations are getting smaller,and the surface is also smoother;the electrical conductivity increases with the increase of the electric field strength.Electric field-assisted low-temperature sintering helps to increase the conductivity of the lines and optimize surface topography.The mechanism of the application of electric field to the formation of silver interconnects at low temperature sintering silver nanoparticles and the effect of electric field strength on apparent morphology,density and conductivity were analyzed.The doped control metal particles could promote the conductivity of the silver interconnect.The electrostatic field assisted sintering can optimize the conductivity,density and surface morphology of the silver interconnect.With the increase of the electric field strength,the apparent morphology and the conductivity become better and better.The doping of controlled metal particles and electrostatic field assisted sintering have greatly improved the conductive properties of the silver interconnects,and have a good guiding role in the following study of nanoimprint technology for the preparation of Ag interconnect.